Electronic & Photonic Packaging Division
Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering.
News & Updates
Call for InterPACK 2022 Papers for a Special Issue of the ASME Journal of Electronic Packaging
InterPACK is a premier international forum for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging and micro/nano-electromechanical systems. It is also the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The Journal of Electronic Packaging (JEP) publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, thermal, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Authors are invited to submit their manuscripts by March 31st 2023, revised from their original conference papers to be considered for the Special Issue.
More information and important dates
Chair | July 2022 – June 2023
Vice Chair | July 2022 - June 2023
Treasurer | July 2022 – June 2023
Secretary | July 2022 – June 2023
Member at Large | July 2022 - June 2023
Staff Contact | July 2022 – June 2023
InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
October 24–26, 2023, San Diego Mission Valley, San Diego, CA
Past EventsInterpack 2022 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
October 25 - 27, 2022
October 26 - 28 2021
October 27 - 29, 2020
Hilton Anaheim, Anaheim, CA,
October 7 - 9, 2019
Honors & Awards
Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.
- Thermal Management Award (Refer to Allan Kraus Thermal Management Medal)
Note: EPPD Division Level Thermal Award Winners are not eligible for the Allan Kraus Thermal Management Medal
For outstanding contributions to thermal management of electronic and/or photonic components and systems, including design, optimization, experimental techniques, modeling and simulation.
- Mechanics Award
For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling.
- Women In Engineering Award
To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
- Young Engineer Award
To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
- Student Member of the Year Award
To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging.
- K-16 Clock Award
(Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics
Nominations link for processing division awards
Links to helpful online resources related to the division are below. If you have suggestions for other resources, please contact the division chair or ASME staff.
Other Links of Interest
- ASME Landmarks Program
Landmarks, sites and collections of historic importance to mechanical engineering are designated by ASME through its History and Heritage Landmarks Program.
- SEMI: Semiconductor Equipment and Materials International
- IMAPS - International Microelectronics And Packaging Society
- IEEE Components, Packaging, & Manufacturing Technology Society
- Society for Experimental Mechanics, Inc.
- NSF Engineering
- Optoelectronics, Microelectronics, Information Technology - Data Storage Systems Center, Carnegie Mellon University
- Integrated Media Systems Center, University of Southern California
- Laser Focus World Online
- Photonics Online
- Optics.org: Photonics Resources for Scientists & Engineers
- Printed Wiring Board (PWB) Resource Center
- SMT NET (Surface Mount Technology Network)
- The Cork Electronics Industry Association (Ireland)
- Armed Forces Communications & Electronics Association
- Electronics Manufacturers Association
- The Semiconductor Subway