Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering.

News & Updates

Call for InterPACK 2022 Papers for a Special Issue of the ASME Journal of Electronic Packaging

InterPACK is a premier international forum for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging and micro/nano-electromechanical systems. It is also the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The Journal of Electronic Packaging (JEP) publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, thermal, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Authors are invited to submit their manuscripts by March 31^st 2023, revised from their original conference papers to be considered for the Special Issue.

More information and important dates

About

The Electronic and Photonic Packaging Division (EPPD) of ASME has as its objectives international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering. The Division is concerned with all design and engineering aspects related to theoretical (analytical and computer-aided) and experimental problems and results associated with the application of methods and approaches of engineering and applied mechanics to the analysis, design, manufacturing, testing and operation of microelectronics, optoelectronics and photonics components, devices, equipment and systems.

Leadership

Seungbae Park
Chair | July 2022 – June 2023

Baris Dagruoz
Vice Chair | July 2022 - June 2023

Sreekant Narumanchi
Treasurer | July 2022 – June 2023

Jin Yang
Secretary | July 2022 – June 2023

Ankur Jain
Member at Large | July 2022 - June 2023

Barbara Zlatnik
Staff Contact | July 2022 – June 2023

Events

Featured Event

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
October 24–26, 2023, San Diego Mission Valley, San Diego, CA

Past Events

Interpack 2022 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Anaheim, CA
October 25 - 27, 2022

InterPACK 2021
Virtual, Online
October 26 - 28 2021

InterPACK® 2020
Virtual, Online
October 27 - 29, 2020

InterPACK® 2019
Hilton Anaheim, Anaheim, CA,
October 7 - 9, 2019

Honors & Awards

Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.

Society Awards:

Division Awards:

Thermal Management Award (Refer to Allan Kraus Thermal Management Medal)
Note: EPPD Division Level Thermal Award Winners are not eligible for the Allan Kraus Thermal Management Medal
For outstanding contributions to thermal management of electronic and/or photonic components and systems, including design, optimization, experimental techniques, modeling and simulation.
Mechanics Award
For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling.
Women In Engineering Award
To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
Young Engineer Award
To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
Student Member of the Year Award
To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging.
K-16 Clock Award
(Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics

Nominations link for processing division awards

Unit Award Nominations

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