Electronic & Photonic Packaging Division

EPPD launched a webinar series in 2025 to beneift the ASME electronic and photonic packaging community by providing technical content of interest to our community and to further engage with members. 

Future Webinars

Coming soon

Past Webinars

February 26, 2025

Thermal Transport in Lithium-ion Cells and Battery Packs
Ankur Jain
Professor, Mechanical and Aerospace Engineering Department
The University of Texas at Arlington

Learn more

Watch the webinar

The Electronic and Photonic Packaging Division (EPPD) of ASME has as its objectives international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering. The Division is concerned with all design and engineering aspects related to theoretical (analytical and computer-aided) and experimental problems and results associated with the application of methods and approaches of engineering and applied mechanics to the analysis, design, manufacturing, testing and operation of microelectronics, optoelectronics and photonics components, devices, equipment and systems.

To contact any of these leaders, use the ASME Volunteer Leader Directory (VLD).

Sreekant Narumanchi
Chair | July 2024 – June 2025

Jin Yang
Vice Chair | July 2024 – June 2025

Ankur Jain
Treasurer | July 2024 - June 2025

Przemslaw Gromala
Secretary | July 2024 - June 2025

Damena Agonafer
Member-at-Large | July 2024 – June 2025

Barbara Zlatnik
Staff Contact

Featured Event

InterPACK®  International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Holiday Inn San Jose - Silicon Valley
San Jose, CA
October 8–10, 2024

Past Events

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
San Diego Mission Valley, San Diego, CA, October 24–26, 2023

Interpack 2022 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Anaheim, CA, October 25 - 27, 2022

InterPACK 2021
Virtual, Online
October 26 - 28 2021

InterPACK® 2020
Virtual, Online
October 27 - 29, 2020

InterPACK® 2019
Hilton Anaheim, Anaheim, CA,
October 7 - 9, 2019

Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.

Society Awards:

• Allan Kraus Thermal Management Medal
• Avram Bar-Cohen Memorial Medal

Division Awards:

• Thermal Management Award (For reference only. Ths award was elevated to the society-level Allan Kraus Thermal Management Medal)
  Mechanics Award
• For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling.
• Women In Engineering Award
  To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
• Young Engineer Award
  To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
• Student Member of the Year Award
  To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging.

K-16 Clock Award

(Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics

Nominations link for processing division awards

Unit Award Nominations

Links to helpful online resources related to the division are below. If you have suggestions for other resources, please contact the division chair or ASME staff.

• Heterogeneous Integration Roadmap
• InterPACK

Other Links of Interest

• ASME Landmarks Program
  Landmarks, sites and collections of historic importance to mechanical engineering are designated by ASME through its History and Heritage Landmarks Program.
• SEMI: Semiconductor Equipment and Materials International
• IMAPS - International Microelectronics And Packaging Society
• IEEE Components, Packaging, & Manufacturing Technology Society
• Society for Experimental Mechanics, Inc.
• NSF Engineering
• Optoelectronics, Microelectronics, Information Technology - Data Storage Systems Center, Carnegie Mellon University  
• Integrated Media Systems Center, University of Southern California
• Laser Focus World Online
• Photonics Online
• Optics.org: Photonics Resources for Scientists & Engineers  
• Printed Wiring Board (PWB) Resource Center
• SMT NET (Surface Mount Technology Network)  
• The Cork Electronics Industry Association (Ireland)
• Armed Forces Communications & Electronics Association
• Electronics Manufacturers Association
• The Semiconductor Subway