Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering.

News & Updates

FY 25 Member At Large, EPPD Executive Committee

The Executive Committee of the Electronic and Photonic Packaging Division (EPPD) is seeking nominations for a new member-at-large committee member. The Member- at-Large elect shall commit to serve for a five-year term with annual rotation through the Committee leadership succession. The 2024 Member-at-Large should be from academia/government/national laboratories.

Learn more about the position and nomination process

About

The Electronic and Photonic Packaging Division (EPPD) of ASME has as its objectives international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering. The Division is concerned with all design and engineering aspects related to theoretical (analytical and computer-aided) and experimental problems and results associated with the application of methods and approaches of engineering and applied mechanics to the analysis, design, manufacturing, testing and operation of microelectronics, optoelectronics and photonics components, devices, equipment and systems.

Leadership

Baris Dagruoz
Chair | July 2023 - June 2024

Sreekant Narumanchi
Vice Chair | July 2023 – June 2024

Jin Yang
Treasurer | July 2022 – June 2024

Ankur Jain
Secretary | July 2022 - June 2024

Przemslaw Gromala
Member at Large | July 2023 - June 2024

Seungbae Park
Past Chair | July 2023 – June 2024

Barbara Zlatnik
Staff Contact

Events

Featured Event

InterPACK®  International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Holiday Inn San Jose - Silicon Valley
San Jose, CA
October 8–10, 2024

Past Events

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
San Diego Mission Valley, San Diego, CA, October 24–26, 2023

Interpack 2022 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Anaheim, CA, October 25 - 27, 2022

InterPACK 2021
Virtual, Online
October 26 - 28 2021

InterPACK® 2020
Virtual, Online
October 27 - 29, 2020

InterPACK® 2019
Hilton Anaheim, Anaheim, CA,
October 7 - 9, 2019

Honors & Awards

Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.

Society Awards:

Division Awards:

  • Thermal Management Award (Refer to Allan Kraus Thermal Management Medal)
    Note: EPPD Division Level Thermal Award Winners are not eligible for the Allan Kraus Thermal Management Medal
    For outstanding contributions to thermal management of electronic and/or photonic components and systems, including design, optimization, experimental techniques, modeling and simulation.
  • Mechanics Award
    For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling.
  • Women In Engineering Award
    To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
  • Young Engineer Award
    To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
  • Student Member of the Year Award
    To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging.
  • K-16 Clock Award
    (Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
    To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics

Nominations link for processing division awards

Unit Award Nominations

ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the K-16 Clock Award. The K-16 Clock Award is an annual award which is typically given every other year to the outgoing K-16 Committee Chair. Given 2024 is an off-year (no outgoing K-16 Chair), this year’s awardee will be selected based on technical excellence as well as service to the community. Additional details are provided on the Call for Nominations flyer.

K-16 Clock Award Call for Nominations

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