Electronic & Photonic Packaging Division
Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering.
News & Updates
FY 25 Member At Large, EPPD Executive Committee
The Executive Committee of the Electronic and Photonic Packaging Division (EPPD) is seeking nominations for a new member-at-large committee member. The Member- at-Large elect shall commit to serve for a five-year term with annual rotation through the Committee leadership succession. The 2024 Member-at-Large should be from academia/government/national laboratories.
Learn more about the position and nomination process
About
Leadership
Baris Dagruoz
Chair | July 2023 - June 2024
Sreekant Narumanchi
Vice Chair | July 2023 – June 2024
Jin Yang
Treasurer | July 2022 – June 2024
Ankur Jain
Secretary | July 2022 - June 2024
Przemslaw Gromala
Member at Large | July 2023 - June 2024
Seungbae Park
Past Chair | July 2023 – June 2024
Barbara Zlatnik
Staff Contact
Events
Featured Event
InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Holiday Inn San Jose - Silicon Valley
San Jose, CA
October 8–10, 2024
Past Events
InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic MicrosystemsSan Diego Mission Valley, San Diego, CA, October 24–26, 2023
Interpack 2022 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Anaheim, CA, October 25 - 27, 2022
InterPACK 2021
Virtual, Online
October 26 - 28 2021
InterPACK® 2020
Virtual, Online
October 27 - 29, 2020
InterPACK® 2019
Hilton Anaheim, Anaheim, CA,
October 7 - 9, 2019
Honors & Awards
Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.
Society Awards:
Division Awards:
- Thermal Management Award (Refer to Allan Kraus Thermal Management Medal)
Note: EPPD Division Level Thermal Award Winners are not eligible for the Allan Kraus Thermal Management Medal
For outstanding contributions to thermal management of electronic and/or photonic components and systems, including design, optimization, experimental techniques, modeling and simulation. - Mechanics Award
For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling. - Women In Engineering Award
To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. - Young Engineer Award
To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. - Student Member of the Year Award
To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging. - K-16 Clock Award
(Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics
Nominations link for processing division awards
Call for Awards Nominations
Deadline: July 21, 2024, 5:00 PM PST
ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the following annual division awards:
1. EPPD Excellence in Mechanics Award
2. EPPD Women Engineer Award
3. EPPD Early Career Engineer Award
4. EPPD Student Member of the Year Award
Review the Awards Flyer for more information including submission process.
EPPD Call for Awards Nominations Flyer
ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the K-16 Clock Award. The K-16 Clock Award is an annual award which is typically given every other year to the outgoing K-16 Committee Chair. Given 2024 is an off-year (no outgoing K-16 Chair), this year’s awardee will be selected based on technical excellence as well as service to the community. Additional details are provided on the Call for Nominations flyer.
K-16 Clock Award Call for Nominations
Links
Links to helpful online resources related to the division are below. If you have suggestions for other resources, please contact the division chair or ASME staff.
Other Links of Interest
- ASME Landmarks Program
Landmarks, sites and collections of historic importance to mechanical engineering are designated by ASME through its History and Heritage Landmarks Program. - SEMI: Semiconductor Equipment and Materials International
- IMAPS - International Microelectronics And Packaging Society
- IEEE Components, Packaging, & Manufacturing Technology Society
- Society for Experimental Mechanics, Inc.
- NSF Engineering
- Optoelectronics, Microelectronics, Information Technology - Data Storage Systems Center, Carnegie Mellon University
- Integrated Media Systems Center, University of Southern California
- Laser Focus World Online
- Photonics Online
- Optics.org: Photonics Resources for Scientists & Engineers
- Printed Wiring Board (PWB) Resource Center
- SMT NET (Surface Mount Technology Network)
- The Cork Electronics Industry Association (Ireland)
- Armed Forces Communications & Electronics Association
- Electronics Manufacturers Association
- The Semiconductor Subway