Microelectromechanical Engineering Division
MicroElectroMechanical Systems (MEMS) are defined as a miniature device or an array of devices combining electrical, mechanical, optical, chemical and/or biological components fabricated via integrated circuit or other similar manufacturing techniques.
About
MicroElectroMechanical Systems (MEMS) are defined as a miniature device or an array of devices combining electrical, mechanical, optical, chemical and/or biological components fabricated via integrated circuit or other similar manufacturing techniques. It is by it’s very nature a multi-disciplinary field
Research, insight, and then applications of MEMS will shape the basis for the creation of technologies that will impact areas as diverse as computing, information technology, biomedical technology, the environment, along with energy, transportation, robotics,. manufacturing, deep space studies, and national security.
Since its start in the late 1960s, the MEMS field has been growing rapidly, especially since 1989. Currently, patents in MEMS are being issued at a rate of over one per day!
The MEMS Division will work towards the goals of: providing a focal point for the Mechanical Engineers entering and practicing in the MEMS field; Facilitating interaction and discussion among the MEMS community and generate opportunities for collaboration in order to spawn and maintain creativity in the field; Identifying the needs and problems of the MEMS community and bring together appropriate people to address them; Provide a platform to generate standards and guidelines for MEMS processes and technologies; Educate and inform engineers and scientists in various fields of the ongoing developments in the MEMS field; Help train new, multi-disciplinary MEMS researchers to enhance the growth of the field.
Leadership
Namwon Kim, Texas State University
Chair | July 2023 – June 2024
Greg Hader, US Army DEVCOM AC
Vice Chair | July 2023 – June 2024
Nazmul Islam, UTRVG
Past Chair | July 2023 – June 2024
Uttam Chakravarty, University of New Orleans
Treasurer | July 2023 – June 2024
Annie Xian Zhang, Steven's Institute of Technology
Secretary | July 2023 – June 2024
In-Hyouk Song, Texas State University
Member-at-Large | July 2023 – June 2024
Laura Herrera, ASME
Sr. TEC Operations Manager | May 2021 – OPEN
Links
Links to helpful online resources related to the division are below. If you have suggestions for other resources, please contact the division chair or ASME staff.
Landmarks, sites and collections of historic importance to mechanical engineering are designated by ASME through its History and Heritage Landmarks Program.
ASME Division
Universities
National Labs
MEMS Information Sites
Upcoming Events
November 17 - 21, 2024
Oregon Convention Center
Portland, Oregon USA
Important Dates
March 19, 2024 Abstract Submission
May 14, 2024 Submission of Full Length Paper
August 20, 2024 Final Paper Submission
Share your research. Advance your career.
Track 13: Micro - and Nano-Systems Engineering Packaging
Topics
13-1 General Topics of MEMS/NEMS
13-2 Design and Fabrication, Analysis, Processes, and Technology for Micro and Nano Devices and Systems
13-3 Computational Studies on MEMS and Nanostructures
13-4 Applications of Micro and Nano Systems in Medicine and Biology
13-5 Micro and Nano Devices
13-6 Applied Mechanics and Materials in Micro- and Nano-Systems
13-7 Packaging Technology in Heterogeneous Integration Applications
13-8 Energy Harvesting and Storage
13-9 Advanced Manufacturing of Microsystems, Microstructures, and Miniaturized Actuators
13-10 Microfluidics 2023
13-11 Inertial Navigation: MEMS/NEMS to Bio-Inspired
13-12 MEMS based Electrochemical Sensors in Biomedical Applications
13-13 Simulations of Material Modeling and Behavior Analysis for MEMS Applications
Student Competitions
$350 towards the conference registration fee.
Best Papers: 3 Awards
Innovative Paper: 3 Awards
Global Impact Paper: 3 Awards
Track 13 Organizers
TIn-Hyouk Song, Texas State University;
Jeong Tae Ok, Shawnee State University
Shaurya Prakash, Ohio State University
Webinar: Complimentary
Introduction to Inertial Sensor and System Testing
May 15, 2024
2:00 - 3:00 PM Eastern Time
Marius Gheorghe, PhD
Chief Engineer, Systems Solutions
Ideal Aerosmith, Inc.
The presentation will debut with an introduction of Ideal Aerosmith, Inc. It will then proceed to present the MEMS inertial sensors and systems, followed by an in-depth coverage of various testing aspects associated with them. This coverage will include both theoretical and practical technical details, ranging from mathematical error models to observability, and to the design of test plans. Finally, the presentation will conclude with real-life failures that will underscore the critical role that rigorous testing plays in ensuring the reliability and functionality of MEMS inertial sensors and systems in real-world applications. Learn More.
Dr. Marius Gheorghe is Chief Engineer – Systems Solutions with Ideal Aerosmith Inc., where he develops test solutions for inertial and non-inertial applications and is mentoring new generations of engineers. His professional career centered on designing test equipment for applications ranging from semiconductors to defense, aerospace, and space programs. He has authored papers for reputable peer-reviewed journals, presented tutorials and papers at IEEE conferences, and is an active voting member in the IEEE Gyro and Accelerometer Panel (GAP) standards committee. He is a member of the Steering Committee for the International Conference on Sensors and Electronic Instrumentation Advances (SEIA), and of the Technical Program Committee of the IEEE International Symposium on Inertial Sensors and Systems (INERTIAL).
Register Today!