Submit a Nomination for the Allan Kraus Thermal Management Medal

Nominations are currently being accepted for the 2020 Allan Kraus Thermal Management Medal, which recognizes an individual who has demonstrated outstanding achievements in thermal management of electronic systems and a genuine commitment to the field of thermal science and engineering. The deadline to submit a nomination by email for the award is Monday, February 10.

Nominees for the for Allan Kraus Thermal Management Medal should have made significant contributions to the field of thermal management of electronic systems as demonstrated by successful product development, seminal papers, filed patents and/or the leadership of research and development programs.

Members of the award’s selection committee are particularly interested in recognizing research into on-package heterogeneous integration (HI), which offers computing and communications devices enhanced functionality, faster time-to-market and improved silicon yield resiliency. HI also underlines the importance of packaging and systems engineers in developing innovative solutions that drive the growth of the semiconductor industry.

The award is sponsored by the Electronic and Photonic Packaging Division (EPPD), which provides a $1,000 honorarium, a bronze medal, a certificate and a travel supplement of up to $750 to the winner to attend the award presentation at ASME’s InterPACK Conference in October 2020.

Nominations should be emailed to Dr. Ravi Mahajan, chair of the Allan Kraus Thermal Management Medal Selection Committee, at ravi.v.mahajan@intel.com by 12:00 a.m. Eastern Time the morning of Feb 10, 2020.

For more information on the Allan Kraus Thermal Management Medal, or view a list of past award winners, visit www.asme.org/about-asme/honors-awards/achievement-awards/allan-kraus-thermal-management-medal.