Special Journal Issue Dedicated to Professor Avram Bar-Cohen

Feb 4, 2021

The ASME Journal of Electronic Packaging is currently accepting manuscripts for a special issue entitled “A Tribute to Prof. Avram Bar-Cohen.”  Authors who are interested in having their manuscripts included in the special issue, to be published in December 2021, should submit their manuscripts by June 15, 2021.
 
This special issue of the ASME Journal of Electronic Packaging is dedicated to Professor Avram Bar-Cohen, who passed away on October 10, 2020. Bar-Cohen helped to pioneer the wider field of thermal management in electronics packaging and mentored over 70 graduate students at four institutions of higher education, all while serving as a prestigious member of academia, industry, and government.  Papers in all disciplines of electronics thermal management are solicited here in honor of him.
 
Manuscripts to be included in the special issue should concentrate on a range of topics (including but not limited to) two-phase flow in minichannels and microchannels; nanoelectronic and optoelectronic thermal management; thermal interface materials; transient thermal management of high-heat flux electronics; thermal management of power electronics and LEDs; heat sink and cold plate optimization; passive radiative cooling for thermal management; thermal metamaterials; novel heat exchangers, including additively manufactured (AM), polymeric, and phase change material (PCM) heat exchangers; and thermoelectric cooling.
 
Manuscripts should be submitted electronically to the journal by June 15, 2021, via Journals Connect at journaltool.asme.org. Authors who have an account should log in and select “Submit Paper” at the bottom of the page.  Authors without an account should select “Submissions” and follow the steps.  At the Paper Submittal page, authors should select “ASME Journal of Electronic Packaging” and then select the special issue “A Tribute to Prof. Avram Bar-Cohen.” Papers received after the deadline or papers not selected for inclusion in the special issue may be accepted for publication in a regular issue.
 
The lead associate editor for the special issue is Professor Ronald J. Warzoha, United States Naval Academy, U.S., warzoha@usna.edu. Guest editors for the special issue include Dr. Peter de Bock, Advanced Research Projects Agency -Energy (ARPA-E), U.S., peter@debock.net; Dr. Darin J. Sharar, U.S. Army Research Laboratory, U.S., darin.j.sharar.civ@mail.mil; and Dr. Andrew Tay, National University of Singapore (NUS), Singapore, andrew_tay@ieee.org.
 
For more information on the ASME Journal of Electronic Packaging, visit https://asmedigitalcollection.asme.org/electronicpackaging.  To learn more about the ASME Journal Program, visit www.asme.org/publications-submissions/journals/information-for-authors.
 

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