New Editor Appointed for ASME Journal of Electronic Packaging
Jul 23, 2020
Lee received his BSc and MSc degrees from National Taiwan University and Virginia Polytechnic Institute and State University, respectively. In 1992, he graduated from Purdue University with a Ph.D. degree in aeronautical and astronautical engineering. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science and Technology. Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer level packaging and 3D IC integration, through silicon vias (TSV) and high-density interconnects, LED packaging for solid-state lighting, lead-free soldering, and reliability analysis.
The research outcomes of Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He has also co-authored three books and nine book chapters. Due to his technical contributions he has received many honors and awards over the years. Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also an IEEE EPS Distinguished Lecturer.