Abstract Deadline Extended for Micro and Nano Forum
Jul 15, 2014
The deadline to submit poster abstracts for the next Society-Wide Micro and Nanotechnology Forum has been extended to July 23. The Forum will take place at the 2014 ASME International Mechanical Engineering Congress and Exposition, to be held Nov. 14-20 at the Palais des Congres convention center in Montreal, Canada.
The annual Society-Wide Micro and Nanotechnology Forum, which is sponsored by the ASME Nanotechnology Institute and the ASME NanoEngineering Council, provides engineering students with the opportunity to present their research to leaders in the micro- and nanotechnology field and to network with their peers and colleagues.
Awards for best poster will be presented in seven different categories: applied mechanics, bioengineering, fluid mechanics, electronic and photonic packaging, materials, MEMS, and heat transfer. A panel of experts from industry, academia and government funding agencies will select the winners. Each award recipient will receive a certificate signed by the ASME president, and several of the awards will include cash prizes.
If you haven’t attended one of the previous Micro and Nano Forums, you can get an idea of what the poster presentations look like by watching a video from last year’s Forum. Six videos, now available on ASME.org, cover the topics “Single-Wire Metal-O2 Battery in Biological Fluids,” “Bio-inspired Stretchable Electronics for Biomedical Devices,” “Bonding Strength of Implant-Cement Interfaces,” “Deformability-Based Separation of Cancer Cells,” “Vascular Stents with Surface Nanopatterning,” and “Rapid Detection of Drug Resistance.”
To submit a one-page poster abstract for the Forum — including the poster’s title, authors, and affiliations — students should visit the 2014 ASME Congress web page www.asmeconferences.org/Congress2014, and indicate that their submission is for Congress Track 17-15. For more information on the 2014 Society-Wide Micro and Nanotechnology Forum, contact Christine Reilley, ASME Emerging Technologies, by e-mail at firstname.lastname@example.org.