88404C - ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020) has been added to your cart.

Proceedings

ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

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01/31/21

88404C

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Focused on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies.

Printed collection of 88 full-length, peer-reviewed technical papers. Topics include:

Heterogeneous Integration
Micro-Systems with Diverse Functionality
Servers of the Future
Structural and Physical Health Monitoring
Energy Conversion & Storage
Transportation: Autonomous & Electric Vehicles

ISBN No: 978-0-7918-5809-7
Total Number of Pages: 756