Proceedings of the ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2019)
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Focused on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies.
Printed collection of 88 full-length, peer-reviewed technical papers. Topics include:
Heterogeneous Integration
Micro-Systems with Diverse Functionality
Servers of the Future
Structural and Physical Health Monitoring
Energy Conversion & Storage
Transportation: Autonomous & Electric Vehicles
ISBN No: 978-0-7918-5809-7
Total Number of Pages: 756
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