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    88751C - Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack2023) has been added to your cart.
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    Proceedings

    Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack2023)

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    Focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies.

    Topics

    Heterogeneous Integration of Electronic Packages
    Data Centers, Servers of the Future, Edge and Cloud Computing
    Flexible and Wearable Electronics
    Power Electronics
    Multiscale Heat Transfer in Optics and Energy Systems
    Autonomous, Hybrid, and Electric Vehicles
    Reliability of Electronic Packages and Systems
    Nano-Scale Thermal Transport and Materials
    This standard has been placed on stabilized maintenance. Requests and recommendations for change from any materially affected and interested party will be considered. Requests should be submitted to CSAdmin@asme.org and include the Standard designation and the rationale for the request.

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