Journal of Electronic Packaging Print
ASME
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This journal publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, optoelectronics, and photonics components, devices, and systems. Originality, practicality, high engineering level, and mechanical (materials) orientation are the major criteria for the acceptance of a submitted paper.
Published: March, June, September, December
Subscriptions currently include the years 2000 - present. Access to archived content prior to the year 2000 can be obtained with an instututional subscription or an ASME Member Article Pack.
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