Special Issue: Selected Papers from IDETC-CIE 2023

Journal of Mechanisms and Robotics
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The ASME Journal of Mechanisms and Robotics invites papers for a special issue drawing on papers from the 47th Mechanisms and Robotics Conference (MR), a premier international forum held as part of the 2023 International Design and Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE 2023). Sponsored by the Mechanisms and Robotics Technical Committee of the ASME Design Engineering Division, this annual gathering will take place in Boston, Massachusetts, August 20-23, 2023.

For this special issue, we aim to publish original research contributions to the theory and application of mechanical systems, mechanisms, and robotics. Topics span areas central to the design and analysis of mechanical, mechatronic, and robotic systems, including kinematics, dynamics, novel mechanisms and robots, software systems, educational practices, and various applications. 

Topic Areas

  • Theoretical and applied kinematics
  • Design and application of novel mechanisms
  • Soft, flexible, and human-safe robots
  • Reconfigurable mechanisms and robots
  • Origami-based systems
  • Rehabilitation and medical robots
  • Exoskeleton/prosthesis design and development
  • Mechanism-based metamaterials

Special Issue Publication Dates

Paper submission window: October 1-31, 2023
Decisions: April 15, 2024
Publication date: October 2024

Submission Instructions

Papers should be submitted electronically to the journal through the ASME Journal Tool. If you already have an account, log in as an author and select Submit Paper. If you do not have an account, you can create one here

Once at the Paper Submittal page, select the Journal of Mechanisms and Robotics, and then under the Special Issue field, select Special Issue on Selected Papers from IDETC-CIE 2023.

Papers received after the deadline or papers not selected for the Special Issue may be accepted for publication in a regular issue.

Guest Editors

Dongming Gan, Purdue University, US, (dgan@purdue.edu)
Ketao Zhang, Queen Mary University of London, UK, (ketao.zhang@qmul.ac.uk)
Damien Chablat, CNRS, France, (damien.chablat@cnrs.fr)

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