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    The American Society of Mechanical Engineers

    Special Issue on Reliability of 3D IC packaging: Recent Progresses in Analysis, Simulation and Experimental Methodology

    Journal of Electronic Packaging
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    Journal of Electronic Packaging
    3D IC packaging is increasingly recognized as a key enabling technology for enhancing performance and achieving functional diversification in advanced packaging systems. To overcome the limitations of monolithic scaling, technologies such as silicon bridges and chiplets have been adopted. Moreover, hybrid bonding, along with W2W and C2W bonding techniques, are being extensively implemented to enable ultra-fine-pitch vertical interconnections. Large-area interposers and embedded components—such as large-scale integration (LSI), embedded deep trench capacitors (eDTC), integrated voltage regulators (IVR), and others—further support the development of next-generation 3D IC packaging aimed at integrated HPC applications. In addition, co-packaged optics (CPO) solutions are being employed to address data transmission challenges by reducing power consumption and latency.

    As these technologies advance, the reliability of 3D IC packaging has become increasingly critical. Accordingly, there is an urgent need to establish robust measurement techniques and simulation-based prediction methodologies to evaluate and ensure reliability. This special issue aims to highlight and disseminate original research contributions focused on the reliability assessment of heterogeneous integration technologies, including 2.5D/3D IC packaging, wafer- and panel-level advanced packaging, CPO packaging, and applications involving emerging devices.

    Topic Areas

    WE WELCOME SUBMISSIONS THAT DEMONSTRATE APPLICATIONS OF TOPOLOGICAL WAVES IN, BUT NOT LIMITED TO, THE FOLLOWING AREAS:

    • Reliability estimation and prediction methodologies in 3D packaging
    • Physical and numerical modeling of mechanical and material behaviors in 3D IC packaging
    • Process simulation and reliability evaluation of hybrid bonding, 3D integration, and wafer/panel-level assembly
    • Integration of artificial intelligence (AI) and machine learning (ML) techniques in reliability assessment
    • Experimental methodologies for reliability assessment in advanced packaging
    • Computational strategies for improving thermal and thermo-mechanical management in advanced packaging

    Special Issue Publication Dates


    Paper submission deadline: September 14, 2026
    Initial review completed: December 1, 2026
    Publication date: June 2027

    Submission Instructions

    Papers should be submitted electronically to the journal through the ASME Journal Tool. If you already have an account, log in as an author and select Submit Paper. If you do not have an account, you can create one here. 

    Once at the Paper Submittal page, select the Journal of Electronic Packaging, and then under the Special Issue field, select Special Issue on Reliability of 3D IC packaging: Recent Progresses in Analysis, Simulation and Experimental Methodology.

    Only submissions that meet the highest standards of quality and merit will undergo a rigorous peer-review process. Papers accepted with minor revisions will be considered for inclusion in the special issue of JVA. 

    Papers received after the deadline or papers not selected for the Special Issue may be accepted for publication in a regular issue.

    Guest Editors

    Chang-Chun Lee, National Tsing Hua University, Taiwan (cclee@pme.nthu.edu.tw)

    Taek-Soo Lee, Korea Advanced Institute of Science and Technology (KAIST), Republic of Korea (tskim1@kaist.ac.kr)

    Chih Chen, National Yang Ming Chiao Tung University, Taiwan, (chihchen@nycu.edu.tw)