Special Issue on Electronics Thermal Management: Fundamentals to Deployment

Journal of Thermal Science and Engineering Applications

Submit Paper

Increasing power densities, heterogeneous integration, and aggressive performance targets across AI accelerators, HPC platforms, and hyperscale datacenters are creating unprecedented thermal challenges across all levels of electronic infrastructure. Addressing these challenges requires both fundamental physical insight and practical engineering solutions that account for transient behavior, coupled multi‑physics phenomena, acoustic noise, reliability, and energy efficiency—beyond traditional steady‑state thermal limits.

This Special Issue brings together fundamental and applied research that advances the state of the art in electronics thermal management. Contributions from academia, industry, and academia–industry partnerships that address physical mechanisms and modeling frameworks, experimental methods and diagnostics, or the design, characterization, and validation of cooling solutions spanning chip, package, board, system, and facility scales are welcome.

---

Topic Areas

Including, but not limited to, the following areas. Interdisciplinary work with a focus on thermal phenomena, spanning thermal, electrical, mechanical, controls, acoustics, and reliability considerations is especially encouraged.