Special Issue on 3D/4D Bioprinting Systems and Bioprinted Constructs for Biomedical Applications

Journal of Medical Devices
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Bioprinting presents a transformative approach to engineering tissues and organs for clinical uses. Beyond regenerative medicine, it has also emerged as a powerful tool for creating three-dimensional tissue and organ models for various biomedical applications, including drug screening and disease modeling. However, further advancements in bioink development and bioprinting techniques are essential to produce biocompatible and fully vascularized tissues and organs.
This special issue will highlight recent progress in the design and enhancement of novel 3D/4D bioprinting systems, the development of innovative bioinks, cutting-edge strategies for vascularizing bioprinted tissues/organs, and the application of bioprinted constructs in diverse biomedical contexts.


Topic Areas

THE SCOPE OF THIS ISSUE INCLUDES BUT IS NOT LIMITED TO:
  • Design and advancement of 3D/4D bioprinting systems
  • Development of novel bioinks
  • Bioprinting of vascularized tissues/organs and strategies for vascularizing bioprinted constructs
  • Applications of bioprinting in tissue engineering and regenerative medicine
  • Biomedical applications of bioprinting, including drug screening and disease modeling

Special Issue Publication Dates


Paper submission deadline: March 15, 2026
Initial review completed: June 15, 2026
Publication date: December 2026

Submission Instructions

Papers should be submitted electronically to the journal through the ASME Journal Tool. If you already have an account, log in as an author and select Submit Paper. If you do not have an account, you can create one here

Once at the Paper Submittal page, select the Journal of Medical Devices and then under the Special Issue field, select Special Issue on 3D/4D Bioprinting Systems and Bioprinted Constructs for Biomedical Applications.

Papers received after the deadline or papers not selected for the Special Issue may be accepted for publication in a regular issue.

Guest Editors

Wujie Zhang, PhD, Professor, Milwaukee School of Engineering (zhang@msoe.edu)

Qingsu Cheng, PhD, Assistant Professor, University of Wisconsin-Milwaukee (chengq@uwm.edu)