Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Aug 28 - Aug 30, 2018
Aug 29 - Aug 30, 2018

Call for Papers!

2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

InterPACK (InterPACK) is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The InterPACK Conference Series was founded in 1992 as the ASME-JSME Joint Electronic Packaging Conference and was renamed InterPACK in 1995. The InterPACK Advisory Committee (IAC) was and EPPD Executive Committee decided in 2017 that InterPACK will be held annually going forward. We are grateful for the continued co-sponsorship of The Japan Society of Mechanical Engineers (JSME) from the beginning of the InterPACK series.

InterPACK 2018 will be held from August 28 – 30, 2018 at the Hilton San Francisco, CA. The call for abstracts will be out shortly. Due to changing landscape and in order to maintain the competitive edge and leadership, going forward, the InterPACK conference will be held annually. The InterPACK path finding workshop (IPW) was held in June 2016, Silicon Valley, CA, USA, in an attempt to revamp and refocus the conference on the most pressing issues facing the InterPACK community. Please see pages 20-24 of the IPW 16 program .

InterPACK will:

  • Have a comprehensive scope that includes but not limited to thermals/mechanics, materials, manufacturing, MEMs/NEMs, photonics thrusts with special emphasis on advanced packaging architectures, electrical, heterogeneous integration
  • Be a systems focused conference covering topics on Heterogeneous Integration (HI), Flexible Electronics and Wearables (FE&W), Internet of Things (IoT), Edge Devices, IOT Data Centers, Power Electronics etc.
  • Seek a broad international attendee list that included but not limited to academia, industry (supply chain, ODMs, OSATs), research institutes, funding agencies, start-ups and entrepreneurs, automobile companies, EDA Vendors etc.
  • Aim at delivering tangible value to industry such as cutting edge “Hot of the Press” research results as such there will be 50 by invitation only presentations by industry, national labs, academia scientists, engineers and scholars.
  • Aim at dissemination of the highest quality papers as such we will follow a rigorous and discriminating paper selection process. Conference will allow time for robust technical discussions in paper sessions (4 papers/90 minutes session), which will follow-up with a JEP special issue.
  • Provide unprecedented technical and HR access to students through industry funded poster sessions as well as in-conference student training for industry & academia assimilation.
  • Include an exciting student poster session competition to encourage active participation of graduate students at the conference. We are hoping to provide travel grants to a large number of students who participate in the poster session competition.
  • Aim at delivering tangible value to academia by providing access and exposure to industry visionaries thru keynotes and “Debate Style” Panels, funding agency leaders, lead research consortia, Start-ups, vendors/exhibitors, which will be directed by a high level, engaged industry advisory board (IAB).
  • Be “immersive” by making use of Social Media for real-time Feedback and to facilitate Conference Participation Strategy (e.g. Easy conference participation planning; Customized participation strategies; Access to conference content – Make this more than an APP), minimal overlap for key events such as Keynotes, Student Poster Sessions and Key Panels and IOT enabled advertising – Use social media for advertising.

To keep up with the tradition of past InterPACKs, we will heavily rely on participation and contribution from our community to fill out conference leadership, track and session chair positions. If you would like to contribute to the conference or need additional information, please contact the conference chair, Kaustubh Nagarkar, We look forward to seeing you to San Francisco, CA in August of 2018!

Tracks for InterPACK

  • Tribology, Head/Media Interface: Contact mechanics, lubrication, friction, wear, contamination, corrosion, thin films, heat-assisted magnetic recording, patterned media recording, magnetic recording
  • Actuator/Suspension and Sensors: Designs and analyses of actuators and novel sensor technologies
  • Servo Control Technology: System dynamics and designs of modern, high precision servo control systems
  • Shock and Flow Induced Vibrations: Air-flow system, flow-structure interactions, shock and vibrations
  • Spindle Motor and Acoustics: Tribology, vibrations, dynamics, and acoustics of disk/media-spindle systems
  • Micro/Nano Technology: Novel design concepts and applications, patterned media, materials
  • Mechatronics, Robotics, and Automation: System designs for intelligent machines; mechatronics involving robots and automation
  • Imaging/printing Technologies and Consumer Electronics: Digital cameras, camcorders, thermal/laser printing, energy harvesting, “green and smart” house technology, ecosystems and other novel technologies and applications
  • Optical Storage and Future Technologies: Design and analysis of integrated opto-mechatronics and storage systems and media
  • Flexible Media Mechanics and Tape Storage: Mechanics and system design of tape drives, lateral tape motion, tape tension, wear, dynamics of high speed flexible tape, web motion, sheet metal, paper systems
  • Storage System and Future Technologies: Data Center, Cloud Computing, and other future storage device/system related technologies.

Co-Located Events



Important Dates


Abstract Submission:
December 1, 2017

Abstract Acceptance/Rejection Notification:
December 15, 2017

Draft Paper Submission:
February 16, 2018

Paper Reviews Completed:
March 9, 2018