ASME Santa Clara Valley Section: Reliability Physics and Failure Mechanisms in Electronics Packaging

Description

Join the ASME Santa Clara Valley Section & the IEEE Electronics Packaging Society Silicon Valley Chapter for a virtual course on November 2nd. This course presents an overview of the physics of failures in electronics packaging. The course discusses key fundamental concepts of reliability physics associated with various stress conditions, including thermal degradation, thermo-mechanical stress, dynamic and vibrational loading, moisture and humidity, as well as electrical current stress. Failure mechanisms studied include chip-package interactions, micro-bump reliability, electromigration performance, inter-layer dielectric (ILD) damage under bumps and Cu pillars, solder joint reliability, drop and vibrational damage, interfacial delamination, and the impact of moisture and environmental humidity. Acceleration factor models for different failure mechanisms are introduced. Stress analysis methods using finite element analysis (FEA) with specific applications to packaging are described. Speaker: Xuejun Fan, Regents’ Professor, Department of Mechanical Engineering, Lamar University