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    The American Society of Mechanical Engineers

    Special Issue on Silicon-Package-Rack-Data Center Thermal Management

    Journal of Electronic Packaging
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    With the rising power density of high-performance computing (HPC) system and the increasing complexity of advanced packaging architectures such as 2.5D and 3D integration, future data centers face growing thermal management challenges. These include higher energy consumption, inefficient cooling solutions, and unoptimized energy systems. This special issue aims to address the challenges, opportunities, and solutions across various scales, including the silicon, package, rack, and full data center levels. Thermal management challenges associated with emerging optical packaging technologies in data centers, especially co-packaged optics (CPO), are also of significant interest.

    The Journal of Electronic Packaging (JEP) publishes papers that use experimental and theoretical methods, approaches, and techniques to address and solve various mechanical, materials, thermal, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

    Topic Areas

    THE SCOPE OF THIS ISSUE INCLUDES BUT IS NOT LIMITED TO:
     
    • Silicon levels thermal management
    • DPackage level thermal management for 2.5D/3D packages
    • Rack/data center thermal management
    • Silicon, package, rack, and full data center multi-level thermal management
    • Thermal management for optical packaging, including CPO

    Special Issue Publication Dates


    Paper submission deadline: December 1, 2025
    Initial review completed: February 2, 2026
    Publication date: June 2026

    Submission Instructions

    Papers should be submitted electronically to the journal through the ASME Journal Tool. If you already have an account, log in as an author and select Submit Paper. If you do not have an account, you can create one here. 

    Once at the Paper Submittal page, select the Journal of Electronic Packaging, and then under the Special Issue field, select Special Issue on Silicon-Package-Rack-Data Center Thermal Management.

    Papers received after the deadline or papers not selected for the Special Issue may be accepted for publication in a regular issue.

    Guest Editors

    Lead Associate Editor:

    Prof. Tiwei Wei, University of California, Los Angeles, USA

    Guest Editors:

    Prof. Han Hu, University of Arkansas, USA

    Prof. Srikanth Rangarajan, Binghamton University, USA

    Dr. Manohar Bongarala, Nokia Bell Labs, USA

    Prof. Chirag R. Kharangate, Case Western Reserve University, USA