Y.C. Lee, Ph.D (2019)
Editor
University of Colorado
Department of Mechanical Engineering
Boulder, CO 80309
P: 303-492-3393
E: leeyc@colorado.edu
Kaixin Cui
Assistant to the Editor

ASSOCIATE EDITORS
  • Mehmet Arik, Ph.D. (2019)
    Ozyegin University, Turkey
  • Mehdi Asheghi, Ph.D. (2020)
    Stanford University, USA
  • Satish C. Chaparala, Ph.D. (2020)
    Corning, Inc., USA
  • Ercan M. Dede, Ph.D. (2021)
    Toyota Research Institute of North America, USA
  • Baris Dogruoz, Ph.D. (2020)
    Cisco Systems, Inc., USA
  • Pradip Dutta, Ph.D (2019)
    Indian Institute of Science, India
  • Toru Ikeda, Ph.D. (2021)
    Kagoshima University, Japan
 
  • Yi-Shao Lai, Ph.D (2019)
    Advanced Semiconductor Engineering (ASE), Inc., Taiwan
  • Xiaobing Luo, Ph.D. (2021)
    Huazhong University of Science and Technology, China
  • Kaushik Mysore, Ph.D. (2020)
    Advanced Micro Devices, Inc., USA
  • Sreekant V. J. Narumanchi, Ph.D. (2021)
    National Renewable Energy Laboratory, USA
  • Jeffrey C. Suhling, Ph.D (2020)
    Auburn University, USA
  • Tse Eric Wong, Ph.D (2020)
    Raytheon Co., USA
ELECTRONIC & PHOTONIC PACKAGING DIVISION Executive Committee
  • Mehdi Asheghi
    Chair

OFFICERS OF THE ASME
  • Said Jahanmir
    President
  • Thomas Costabile
    Executive Director
  • Bryan A. Erler
    Secretary/Treasurer
PUBLISHING STAFF
  • Philip Di Vietro
    Managing Director, Publishing
  • Colin McAteer
    Manager, Journals
  • E. Hodge
    Production Coordinator
PAST EDITORS
  • Peter Engel
  • Ephraim Suhir
  • Bahgat Sammakia
TECHNICAL COMMITTEE ON PUBLICATIONS AND COMMUNICATIONS
  • Shiv G. Kapoor
    Chair
  • Jane Davidson
    Vice-Chair
  • Bahram Ravani
    Chair, Board of Editors

Transactions of the ASME, Journal of Electronic Packaging (ISSN 1043-7398) is published quarterly by ASME, Two Park Avenue, New York, NY 10016. Send address changes to Transactions of the ASME, Journal of Electronic Packaging, c/o The Sheridan Press, 450 Fame Avenue, Hanover, PA 17331.

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