NOTE: This isInterPACK 2017
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Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Aug 29 - Sept 1, 2017

Program - Posters


Student Poster Competition and Industry/Academia Poster Exhibition

Dr. Banafsheh BarabadiDr. Banafsheh Barabadi
Research Affiliate
Massachusetts Institute of Technology

The organizing committee of InterPACK 2017 are delighted to announce that there will be Student/Industry/Academia Poster and Networking Sessions held at the 2017 joint InterPACK conference at the Hilton San Francisco Hotel in San Francisco, California. For the first time, there will be two poster tracks "Student Poster Competition" and "Industry/Academia Poster Exhibition" which will allow for close interaction and technical discussions between academic and industry members throughout the conference.  The poster sessions are open to all registered students, industry and academia members. You have to submit an abstract for poster!

Student Poster Session

This session provides an opportunity for students to present their research as well as to interact with industry sponsors, fellow students and researchers, and other conference attendees. The poster session will also provide the opportunity to interested students to distribute their resumes and connect with attending industry representatives. Posters will be competitively selected for presentation and travel grants pending the availability of funds.

The Student Poster Session will also feature a poster competition. Posters will be judged based on technical content, clarity of the message, novelty and originality of the work, overall impact of the display, and the students' presentation in front of their posters to the judges.   Awards will be given to the best posters. This activity will be sponsored by the ASME InterPACK Industrial Sponsors, ASME EPPD, and NSF. The awardees will also have the opportunity to give an oral presentation in one of the conference technical sessions.

Submission and Selection Requirements:

  • You must submit an abstract for poster!
  • There is no requirement to submit a paper in order to participate in the poster sessions.
  • Student poster presenters must be enrolled in a degree program at an academic institution and be registered as a student at InterPACK 2017.
  • All posters in "Student Poster Session" will be reviewed by a poster committee and selected for presentation and travel grants. Awardees will be informed prior to the conference.
  • Travel grant awardee must participate in both the Student Poster Session and in tutorials and/or workshops at InterPACK 2017 to receive their reimbursements.

Industry/Academia Poster Exhibition

The organizing committee are pleased to announce that for the first time, there will be an Industry Poster Exhibition which welcomes all industry members to submit posters. The posters will be on permanent display throughout (or at least 1-day at) the conference, which will provide a platform for continuous interaction between the authors and the conference attendees during the course of the conference.  Authors will be required to attend their posters during the designated time for Industry Poster Exhibition. The participants will receive a certificate from InterPACK that acknowledges their outstanding contribution to the conference and community.

Submission and Selection Requirements:

  • You must submit an abstract for poster!
  • There is no requirement to submit a paper in order to participate in the poster sessions.
  • Industry/academia poster presenters must register for the conference and be present during the 2-hour designated time for the Industry Poster Exhibition.