NOTE: This isInterPACK 2017
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Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Aug 29 - Sept 1, 2017

Program - Call for Papers


InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of Electronics Packaging and Heterogeneous Integration in Micro-Systems. It is the flagship conference of the ASME Electronics and Photonics Packaging Division (EPPD). The international nature of the meeting has been highly beneficial in promoting global interactions between Industry and Academia. In addition to paper presentations and vendor exhibits, InterPACK 2017 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a student poster session. Original papers are solicited in the general track/topic areas of (but not limited to):

Heterogeneous Integration: Micro-Systems with Diverse Functionality: Evolution of Mobile Devices, Ubiquitous interfaces, Virtual Reality (VR) systems, Internet of Things (IoT), Edge and Cloud Computing.

  • Microsystems Integration, Integrated Photonics, RF Packaging, LED and Optoelectronics.
  • Advanced Materials and Processes, including constitutive behavior, modeling and characterization of electronic materials, such as underfills, molding compounds, dielectrics and new strategic materials tailored for specific applications.
  • Thermomechanical stresses and reliability of integrated devices, MEMS RF resonators, hermetic packaging, fracture, fatigue & delamination of interfaces and interconnects.
  • Additive manufacturing, high volume manufacturing principles.
  • Advanced packaging for diverse functionality including die stacking, multichip modules. System in Package (SiP), chip package interaction.
  • Interconnect and substrate technologies, advanced packaging architectures that include Through-Silicon Vias (TSV), wafer and panel level packaging (Fan-in, Fan-out) technologies.
  • Cooling solutions/technologies: Thin, flexible, advanced heat spreader technologies, thermoelectrics, phase change materials, diamond, high thermal conductivity polymers.

Servers of the Future: High Performance Computing including Exascale Computing and Cloud Computing with Advanced Networks

  • High-Bandwidth efficient interconnects, Silicon photonics, embedded packaging.
  • Data centers, energy efficient systems, rack level cooling, modeling and simulation.
  • Thermal Interface Materials & thermal underfills, device and component level thermal management in Multi-Chip-Modules that include 2D, 2.5D and 3D constructions.  
  • Cooling technologies from the heat sink to the system including advanced heat spreader technologies, thermoelectrics, fans, pumps, thermo-siphons, compact refrigeration, and phase change materials.
  • Electronic Design Automation (EDA), innovative modeling and measurement techniques.

Health Monitoring in Humans and Structures: Sensors and devices for structural health monitoring, wearable and implantable devices for human factors, human performance, and health monitoring, manufacturing and packaging methods, reliability.

  • Flexible and Wearable (Hybrid) Electronics, stress and fracture in flexible electronics, printed electronics, thin die handling, substrate materials, non-contact processes.
  • Singular& distributed sensors & actuators, MEMS/NEMS.
  • Microfluidics, biosystems & biomedicine, fabrication, integration, hermetic packaging,& reliability, implantable medical devices, neural interfaces.

Energy Conversion & Storage: Renewable and sustainable energy conversion devices, efficient power electronics, electrochemical and thermal storage devices, packaging for harsh environments.

  • Power electronics packaging and module assembly, Wide Bandgap Semiconductor packaging.
  • Harsh environment sensors, high temperature electronics.
  • Photovoltaics, thermoelectrics, inverters, thermo-photovoltaic systems, reliability, distributed sensing, MEMS/NEMS, interconnects and solders.

Transportation: Autonomous & Electric Vehicles: Autonomous Vehicles, High-Speed Rail, Unmanned Aerial Vehicles (UAV), CubeSats, Aviation and Automotive Electronics, Electric Motors and Power Systems for Transportation

  • MEMS/NEMS, sensors and actuators, 5G, LIDAR, RADAR.
  • Radiation hardened devices and packaging, high temperature electronics, ASIC integration, System-in-Package (SiP), interconnects.
  • Thermal management of electric motors and power systems.
  • System level reliability, prognostics, materials characterization, reliability modelling, simulation and test methods, solder joint reliability.

Publication, poster and presentation options:

Technical Papers: InterPACK 2017 aims to disseminate the highest quality technical papers. As such we will follow a very rigorous and discriminating paper selection process. The conference will allow time for robust technical discussions in paper sessions (4 papers/90 minutes session). The conference will also encourage the publication of excellent papers in a special issue of the ASME Journal of Electronic Packaging.

Poster Presentations: InterPACK 2017 will have a renewed emphasis on poster sessions, which will allow for close interaction and technical discussions throughout the conference. The participants will receive a certificate from InterPACK that acknowledges their outstanding contribution to the conference and community. For the first time, we will offer two poster tracks, namely:

  • Student Poster Competition/Session: The "Student Poster" submissions will not require a paper submission. We will have a two-hour session (No Other Activities in Parallel) that will feature 100 Student Poster Presentations. Student travel grants will be provided (pending the availability of funds). Awards (Plaques, Cash) will be given to the best poster presentations. This activity will be sponsored by the ASME InterPACK Industrial Sponsors, ASME EPPD, and NSF.
  • Industry/Academic Poster Exhibition: The posters will be on permanent display throughout the conference, which will provide a platform for continuous interaction between the authors and the conference attendees during the conference coffee breaks. Authors will be required to attend their posters during two of the designated times for Industry/Academic Poster sessions.

Technical Presentation ONLY: InterPACK 2017 will also accept presentations by the leaders of industry, national labs, and academia to share the cutting-edge research without the burden of preparing a technical manuscript. InterPACK will follow a very rigorous and discriminating selection process with a lower acceptance rate than technical paper submissions. Keynote and some invited speakers will also be eligible for Technical Presentation Only upon request. There will be no financial incentive such as registration waiver.