InterPACK®

Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Conference
Aug 29 - Sept 1, 2017

Speakers - Technology Talks

 

Technology Talks

Track 1: Heterogeneous Integration; Microsystems with Diverse Functionality

8-1-1 Enhancing Thermal Transport at Material Interfaces
Friday, September 01, 2017
7:30AM – 9:00AM
Session Organizer: Prof. Samuel Graham, Georgia Institute of Technology

Thermal interfaces play a significant role in electronic devices, especially those that operate under high power densities. This paradigm is of special interest to wide bandgap devices under development for future power electronics and rf devices for 5G and communication systems. Recently, methods to control the thermal boundary resistance between materials in electronic systems have shown great promise, allowing improved thermal control of electronics during operation. This Technology Talk will cover the fundamentals of thermal interfaces in electronic devices from phonon transport through practical limitations due to device material composition and architecture. Applications to a range of emerging semiconductor technologies will be discussed.

Ravi Prasher

Dr. Ravi Prasher, Lawrence Berkeley National Laboratory

Ravi is the Division Director of Energy Storage and Distributed Resources division at LBNL. Ravi joined LBNL in June 2015. Prior to joining LBNL, Ravi was the VP of product development of Sheetak Inc., a startup developing solid state thermoelectric energy converters and was a former program manager at ARPA-E. Prior to joining ARPA-E, Ravi was the technology development manager of thermal management group at Intel. Ravi has published more 85 archival journal papers and holds more than 30 patents. He is a fellow of ASME and a senior member of IEEE. He was the recipient of Intel achievement award (highest award for technical achievement in Intel). He is also a recipient of outstanding young engineer award from components and packaging society of IEEE. Ravi obtained his B.Tech. from IIT Delhi and Ph.D. from Arizona State University.

Manipulating Interfacial Thermal Transport Using Surface Chemistry

Thermal interfaces play a significant role in variety of technologies such as microelectronics, Li-Ion batteries, and thermal insulation of buildings. In many applications such as microelectronics large interfacial conductance is desired whereas in some applications very low interfacial conductance is desired. Thermal interface conductance can be tuned by orders of magnitude by manipulating phonon transmissivity. Surface chemistry can either make the interfacial bond strength very weak (van der Waals) or very strong (covalent) leading to significant changes in phonon transmissivity.

Patich Hopkins

Professor Patrick E. Hopkins, University of Virginia

Patrick E. Hopkins is an Associate Professor in the Department of Mechanical and Aerospace Engineering at the University of Virginia. Patrick's current research interest are in energy transport, charge flow, laser-chemical processes and photonic interactions with condensed matter, soft materials, liquids, vapors and their interfaces. Patrick's group at the University of Virginia uses various optical thermometry-based experiments to measure the thermal conductivity, thermal boundary conductance, thermal accommodation, strain propagation and sound speed, and electron, phonon, and vibrational scattering mechanisms in a wide array of bulk materials and nanosystems. Patrick has authored over 140 technical papers (peer reviewed) and been awarded 3 patents. Patrick is the recipient of an Air Force Office of Scientific Research Young Investigator Award, an Office of Naval Research Young Investigator Award, the ASME Bergles-Rohsenow Young Investigator Award in Heat Transfer, and the Presidential Early Career Award for Scientists and Engineering.

Interfacial imperfection effects on thermal boundary resistance in electronic materials and devices

Typical solutions to thermal mitigation of high power devices have traditionally relied on engineering the thermal conductivity of substrates and submounts, such as diamond, to mitigate unwanted temperature rises and device inefficiencies. Increased operating powers and temperatures combined with efforts in heterogeneous integration have given rise to device efficiencies being directly correlated to the thermal boundary resistances (TBR) at these submount interfaces. In this talk, I will discuss examples in which the power densities at failure of high power and high frequency devices are directly correlated to the TBR at the substrate interfaces, and the role that defects, roughness and other asperities at the material contacts have on the TBR. Through a survey of both computational and experimental literature over the past decade, I will discuss the role of these interfacial imperfections on TBR, and how these can lead to both increases in TBR, and, in some cases decreases in TBR through judicious engineering of the properties of these defects. I will then discuss the role of vibrational energies/phonon dispersions and crystalline disorder on mode conversion, energy transmission, and the resulting TBR.


Track 2: Servers of the Future

8-2-1 Hyperscale Data Centers
Friday, September 01, 2017
9:15 PM – 10:45 PM
Session Organizer: Prof. Samuel Graham, Georgia Institute of Technology

Hyerscale data centers have unique thermal challenges. High power chips are enabling high-performance servers and networking switch and energy efficient cooling facilities are required to support them. In this session, industry experts share their views on innovative thermal management at hyperscale.

Ali Heydari

Ali Heydari, Baidu USDC: Ali Heydari is Senior Technical Director and Chief Data Center Architect at Baidu, the largest search engine and AI company in China. In this role, he is server and data center architect in charge of hardware and data center design, development and deployment in Baidu. Formerly, he was Senior Hardware Engineer at Twitter where he was responsible for grounds up development of Twitter's data center ODM server development. Earlier, he was Senior Hardware Engineer at Facebook where he helped in developing Facebook's original OCP server and data center products. Prior to that he worked at Sun Microsystems and spend about 10 years as Associate Professor of Mechanical Engineering at Sharif University of Technology in Iran. He received his B.S. in mechanical engineering from University of Illinois, Urbana, M.S., Ph.D. in mechanical engineering and M.A. in applied mathematics from University of California, Berkeley.

Driving Innovations in Hyperscale AI-Enabled Data Centers

Hyperscale data centers are estimated to exceed all high-end, midtier to localized servers deployed in the next 5 years. Artificial intelligence and IOT world will be the driving force behind the next generation of data centers with the highest adaptation in the hyperscale data center market. In this presentation, a roadmap of AI-enabling server and data center hardware technology and infrastructure with emphasis on TCO, reliability and performance is presented.

 

Katharine Schmidtke

Katharine Schmidtke, Technical Sourcing Manager, Optical Strategy, Facebook (USA)

Katharine Schmidtke is responsible for Optical Technology strategy at Facebook. She obtained a Ph.D. in non-linear optics from Southampton University in the UK and completed post-doctoral research at Stanford University. She has over 20 years' experience in the Opto-Electronics industry including positions at New Focus, JDSU (now Lumentum), and Finisar Corporation.

Increasing Datacenter Bandwidth: A Technology or a Manufacturing Issue?

The scale of optics deployments at hyperscale datacenters is redefining Packaging as a new focus. Optical technology is no longer restricted to a niche telecommunications application, but is being deployed at increasingly larger volumes in data centers. As optical technology finds applications in interconnecting not just switches but also servers, the scale will experience a step function that will drive innovation in integration and packaging to solve thermal challenges and improve manufacturability, and reliability.

Magnus K. Herrlin

Magnus K. Herrlin and Henry Coles, LBNL

Magnus Herrlin is a member of the High Tech Group at Lawrence Berkeley National Laboratory where he manages a diverse portfolio of energy efficiency projects in data centers. Magnus is also President of ANCIS Incorporated, a consultancy providing thermal and energy solutions for data centers. Prior to establishing ANCIS, he served ten years as Principal Scientist with Bell Communications Research where he led efforts in optimizing energy and cooling efficiency of electronic equipment rooms. Magnus holds a Ph.D. in Building Services Engineering from the Royal Institute of Technology, Stockholm, Sweden.

Immersion Cooling of Electronics and Related Data Center Research at LBNL:

A large amount of energy is consumed to cool electronic equipment in data centers. Two-phase immersion cooling has the capacity to substantially reduce the energy requirement for high-performance computing data centers. This methodinvolves immersing the electronic equipment in a non-conductive liquid that changesphase from a liquid to a gas when heated. In 2016, Lawrence Berkeley National Laboratory completed a demonstration project, and we will share some of the most important findings. Related data center research at LBNL includes developing innovative ways of packaging energy-saving measures for quick and inexpensive implementation. The focus has been to approach hard-to-reach markets with great potential for reducing the cooling energy, such as smaller data centers. There are tremendous opportunities to save energy in this segment but also tremendous non-technical barriers. We will present some of the results from our research and also provide some initial thoughts on removing the barriers.


Track 3: Structural and Physical Health Monitoring

8-3-1 Structural and Physical Health Monitoring
Wednesday, August 30, 2017
9:15AM – 10:15AM
Session Organizer: Prof. Fu-Kuo Chang, Aeronautics & Astronautics, Stanford, CA

Hendrik F. Hamann

Dr. Hendrik F. Hamann, IBM TJ Watson Research Center

Dr. Hendrik F. Hamann is a Distinguished Research Staff Member and Research Manager in the Physical Sciences Department at the IBM T.J. Watson Research Center, Yorktown Heights, NY. He received his PhD from the University of Göttingen. In 1995 he joined JILA as a Research Associate in Boulder, Colorado. Since 2001 he is leading the Physical Analytics program in IBM Research. His current research interest includes the combination of physical model, machine-learning and big data technologies, internet of things, sensor networks, and sensor-based physical modeling with applications to renewable energy, precision agriculture etc. He has authored more than 90 peer-reviewed scientific papers and holds over 90 patents. Dr. Hamann is the winner of the 2016 AIP Prize for Industrial Applications of Physics, he is an IBM Master Inventor, a member of the IBM Academy of Technology and has served on governmental committees such as the National Academy of Sciences, the National Science Foundation and as an industrial advisor to Universities.

Big data gets physical: Structural and physical health monitoring during the age of IoT

While in the past most information on the internet was generated by humans or computers, with the emergence of the Internet of Things, vast amount of data is now being created by sensors from devices, machines etc, which are placed in the physical world. Here we present a series of example applications enabled by such sensor data and what we call "Physical Analytics", which provides underlying intelligence for structural and physical health applications. The end-to-end solutions and experiments, which are being presented in this talk, range from infrastructure management and optimization, environmental sensing and controls, to earth quake forecasting. All these different applications have been built using a single platform, which is comprised of a set of "configurable" technologies components including ultra-low power sensing and communication, big data management technologies, numerical modeling for physical systems, machine learning based physical model blending, and physical analytics based automation and control.

Janos Veres

Dr. Janos Veres, PARC, a Xerox Company

Janos Veres leads PARC's Novel and Printed Electronics Program. He is passionate about the future of manufacturing and the new ecosystems enabled by digital technologies. His main interest is exploring 2D and 3D printing and large area processes as manufacturing techniques for electronic devices. By combining novel materials, device designs and unique deposition processes, it becomes possible to print flexible circuits, sensors, memory and hybrid electronic systems. Janos has held R&D, manufacturing and management positions in material, printing and electronics companies including PolyPhotonix, Kodak, Merck, Avecia, Zeneca and Gestetner, where he developed printed circuits, specialty functional materials, OLEDs, displays, and medical devices as well as printing/coating technologies. Janos holds a Ph.D. in Solid State Electronics from Imperial College, London.

Digital fabrication for the IOT: The future Internet of Things (IOT) will require custom solutions to sense and interpret the world. Tailor made intelligent features are needed that are able to serve thousands of ever-changing, specialist deployments, increasingly becoming part of the very fabric of the physical world around us. Printing is a promising approach to tightly integrate and customize sensors and electronics with devices and objects. Novel printing technologies are beginning to emerge that enable conformal electronics and even printing with inks containing microchips. This in turn also creates new openings for the progress of electronics itself. Over the last 50 years silicon microelectronics advanced through shrinking device dimensions and packing more and more functionality into tiny spaces. Printing technologies open up exciting new ways of scaling electronics "Beyond Moore", through the integration of micro and macro, creating new form factors, complex shapes, conformal devices and distributed systems. Printed, hybrid electronics systems will enable new classes of IOT devices; sensor systems, structural electronics and wearable devices, where the "system is the package".

David Ramahi

David Ramahi, CEO, Optomec, Inc.

David Ramahi, CEO, Optomec, Inc. Mr. Ramahi has been an investor and member of the Optomec Board of Directors since 1998. In 2002, he joined the Company full time to lead its transition from initial technology development to commercial sales. Under Mr. Ramahi's leadership, Optomec has set and executed a focused business strategy that has led to profitability and high revenue growth. More recently, he has overseen the expansion of the product portfolio to include Additive Manufacturing hardware and software solutions that are uniquely targeted at 3D Printed Electronics and the Internet of Things. Prior to Optomec, Mr. Ramahi was based in Belgium as the Director of European Sales for Rosetta Technologies, and following a successful acquisition acted as Director of European Major Accounts for Engineering Animation. Mr. Ramahi received his B.S. in Mechanical Engineering from the MIT.

Computational Modeling of Multi-functional Structures: We live in a 3-dimensional world, and to fully realize the IoT vision of ubiquitous Smart Connected products, sensing and connectivity must conform to that 3D reality. However, legacy Sensor & Antenna production and integration is generally 2D in nature, failing to optimize for cost, size, weight and performance when adapted to 3D products. This session describes how Optomec's patented Aerosol Jet solution for 3D Printed Electronics can directly print or integrate 3D Sensors and 3D Antenna onto existing industrial structures and consumer products, an essential building block for IoT rollout. Printable Sensor types presented will include Strain, Creep, Current, Gas, Temperature, RF, etc; as well as a wide variety of Antenna types including Bluetooth, NFC, WiFi, etc. Solutions for improving the packaging/assembly process for traditional discrete sensors and antenna in a 3D setting also will be discussed. The benefits of a direct digital approach include lower manufacturing cost, as well as functional benefits; ie: a tightly coupled sensor provides more sensitive data, which is critical to maximizing LifeCycle savings in Industrial applications, like Condition Based Maintenance and Predictive Analytics. Finally, emerging developments in the supply of standard printable sensor and antenna reference libraries will be discussed.


Track 4: Energy Conversion & Storage

8-4-1 Packaging Challenges and Opportunities for Photovoltaics and Thermoelectrics
Thursday, August 31, 2017
02:15 PM – 03:45 PM
Session Organizers: Dr. John Reifenberg, Alphabet Energy, Dr. Matthew Reese, National Renewable Energy Laboratory

The two technical talks in this Session will focus on the state of the art, challenges, opportunities, and future directions in the packaging of photovoltaic cells and modules, as well as in thermoelectric-based devices for space and terrestrial power systems and waste-heat recovery applications.

Michael D. Kempe

Dr. Michael D. Kempe, National Renewable Energy Laboratory (NREL)

Dr. Michael D. Kempe is a senior scientist and studies the factors that affect the longevity of PV cells and modules. His work concerns primarily modeling and measuring moisture ingress into PV modules and studying the effect of moisture on polymer adhesion, device performance, and component corrosion. His work also includes the development of a technique for measuring the moisture permeation rates in films at levels around 10-6 g/m2/day and the evaluation of edge seal materials. He is also studying the effects of ultraviolet radiation and heat on the mechanical, chemical, and electrical stability of PV packaging components. This effort is tied into creating qualification tests that accurately assess safety and are predict long-term durability.

Packaging Needs and Considerations for Photovoltaic Modules The packaging materials used in PV modules serve multiple purposes. They physically hold components in place, provide electrical insulation, optically couple superstrate materials (e.g., glass) to PV cells, protect components from mechanical stress by mechanically de-coupling components via strain relief, and protect materials from corrosion. To do this, the packaging materials must adhere well to all surfaces, remain compliant, protect against electric shock at up to 1500 V DC, and transmit light after exposure to temperature, humidity, and UV radiation histories. The safety and durability standards, IEC 61730 and IEC 61215, are primarily responsible for much of the determination of the suitability of a material for a PV application. However, there is still much work being done on these standards to enable them to more accurately determine if a module will be safe and durable for the 25 y warranty period.

Here we describe common materials and configurations of PV modules and the reasons behind the choices. In some cases this is determined by historical data as opposed to the qualification standards. In recent years, cost pressures have led manufacturers to select inadequate materials which fail in the field despite passing the qualification tests. This highlights the need for modification of testing standards and the need for testing beyond the qualification tests for new designs and materials used in the PV industry.

Samad Firdosy

Samad Firdosy, Jet Propulsion Lab

Technologist / Materials Engineer with expertise in the areas of Metal additive manufacturing, laser engineered net shaping / directed energy deposition. Metal - Ceramic bonding. Brazing and diffusion bonding. Mechanical properties of brittle materials. Hydrogen / Oxygen fuel cell MEA and catalyst development. Materials selection and characterization. Scanning electron & optical microscopy. Thermoelectric device design and fabrication.

Development of Thermoelectric-Based Space and Terrestrial Power Systems – Considerations for Device Fabrication Thermoelectric (TE) power sources have consistently demonstrated their extraordinary reliability and longevity for deep space missions as well as for some unique terrestrial applications where unattended operation in remote locations is required. They are static devices with a high degree of redundancy, no electromagnetic interferences, with well documented "graceful degradation" characteristics and a high level of modularity and scalability. They are also tolerant of extreme environments (temperature, pressure, shock and radiation). The development of new, more efficient materials and devices is the key to improving existing space power technology and expanding into efficient, cost-effective systems using high grade heat sources, generated through fossil fuel combustion or from waste exhaust streams in transportation, industrial and military applications.

Currently, in partnership with industry and academia, JPL is leading the development of advanced thermoelectric power generation technologies with couple-level beginning of life thermal to electric conversion efficiencies up to 15% depending on operating conditions. However, significant challenges remain in developing robust, long-life thermoelectric devices that can be reliably integrated in future space power and terrestrial waste heat recovery applications. An overview of current approach and recent progress in addressing and resolving some key challenges in fabricating robust, long-life thermoelectric devices will be presented.


Track 5: Transportation – Autonomous & Electric Vehicles

8-5-1 The Changing Landscape of Automotive Electronics
Wednesday, August 30, 2017
7:30AM – 8:30AM
Session Organizer: Dr. Przemyslaw Jakub Gromala, Dr. Ercan M. Dede

The changing landscape of automotive electronics will be presented in two technology talks. Specifically, the impact of future wide bandgap device technology on advanced power electronics systems will be discussed. Additionally, the fast moving area of automotive startups will be highlighted. Challenges and future opportunities for technologists and researchers in this field will be covered.

Alan Mantooth

Dr. H. Alan Mantooth, University of Arkansas

H. Alan Mantooth received his Ph.D. in electrical engineering from the Georgia Institute of Technology in 1990. He worked for 8 years in the design automation industry before returning to the University of Arkansas to join the faculty of the Department of Electrical Engineering where received is BSEE and MSEE degrees. He currently holds the rank of Distinguished Professor. His research interests now involve analog and mixed-signal IC design & CAD, semiconductor device modeling, power electronics, and power electronic packaging. Dr. Mantooth helped establish the National Center for Reliable Electric Power Transmission (NCREPT) at the UA in 2005. He serves as the Executive Director for NCREPT as well as two of its centers of excellence: the NSF I/UCRC on GRid-connected Advanced Power Electronic Systems (GRAPES) and the Cybersecurity Center on Secure, Evolvable Energy Delivery Systems (SEEDS) funded by DoE. In 2015, he also helped to establish the NSF Engineering Research Center entitled Power Optimization for Electro-Thermal Systems (POETS) that focuses on high power density systems for transportation applications. Dr. Mantooth holds the 21st Century Research Leadership Chair in Engineering. He currently serves as President of the IEEE Power Electronics Society. Dr. Mantooth is a Fellow of IEEE, a member of Tau Beta Pi and Eta Kappa Nu, and registered professional engineer in Arkansas.

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions: A vision for the future of 3D packaging and integration of silicon carbide (SiC) power modules is presented. Several major achievements and novel architectures in SiC modules from the past and present have been highlighted. Having considered these advancements, the major technology barriers preventing SiC power devices from performing to their fullest ability were identified. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules are described, and the concept for a novel SiC power module is described.

Yvonne Lutsch

Dr. Yvonne Lutsch, Director of Technology Scouting and Business Development, Robert Bosch LLC Palo Alto

Dr. Yvonne Lutsch is Director of Technology Scouting and Business Development for Bosch Automotive Electronics in North America, located in the heart of Silicon Valley, Palo Alto. Her passion is to create and foster innovation within Bosch, acting as a mentor in internal and external startup activities. Her team's focus is to identify startup companies, disruptive technologies, business models, or partnerships which have the potential to create significant value to future products of the Automotive Electronics Division. The division develops, produce, and sells microelectronic products and services in the automotive, light electrical mobility, consumer sensors and IoT space. In addition, her mission is to identify new business opportunities and develop strategic partnerships. Prior to this position Yvonne was Director of Quality Management and Methods at Bosch Sensortec - a subsidiary of Robert Bosch GmbH, Germany - with global product quality responsibility. Before that she worked in different areas in MEMS engineering and quality management within Bosch. Yvonne received a diploma in experimental Physics from University of Siegen, Germany, and holds a PhD in Applied Physics from University of Tuebingen, Germany.

Challenges and Opportunities of Cooperating with Fast Moving Startups in the Automotive Space

Abstract: This talk will give an overview of the current trend of cooperating and partnering between automotive players like OEM and Tier 1 and startups or other newcomers in the field of autonomous, connected and electrified vehicles. Challenges and opportunities will be discussed; on the one hand we have huge chances to learn and benefit from each other, on the other hand there are hurdles to overcome, such as different speed, culture, mindset and risk-taking. Some real world examples and best practices will be shared during the talk.


Track 5: Transportation – Autonomous & Electric Vehicles

8-5-2 Wireless Power Beaming - History, Applications, & Challenges
Wednesday, August 30, 2017
8:30AM – 9:00AM
Session Organizers: Dr. Przemyslaw Jakub Gromala, Dr. Ercan M. Dede

Abstract: Although it was Nikola Tesla who conceived of microwave wireless power transmission more than 100 years ago, it was W.C. "Bill" Brown of Raytheon who first reduced wireless power beaming (WPB) to practice, with the 1965 invention of the rectifying antenna and the 1975 demonstration of 34 kW delivered at 2.4GHz across a one mile distance. Recent advances in solid-state microwave technology have dramatically expanded the opportunity-space for WPB and brought renewed attention to the system engineering, packaging, and thermal management challenges that must be overcome if the full benefits of this disruptive technology are to be realized.

WPB is a key enabling technology for powering space platforms, space exploration vehicles, and future space colonies, as well as delivering solar power from space to the power grid on earth and to remote off-grid locations. Such long-distance wireless power beaming, extending well beyond conventional wireless power transmission (WPT), can also play a critical role in delivering renewable power from uninhabited regions to the earth's population centers and in powering unmanned vehicles from ground-based or airborne transmitters.

This presentation will open with a review of Tesla's and Brown's pioneering work and continue with discussion of the early and current WPB-based Solar Power Satellite efforts in the US, Japan, and China, as well as other potential terrestrial and space applications. Attention will then turn to describing a notional WPB system and the key component, packaging, and system technologies needed to enable such applications, including compact solid state RF power modules/converters, conformal and low mass RF receiver antennas, and advanced thermal management techniques. The presentation will close with a brief overview of the space solar power roadmap recently presented to senior US government officials in the Defense, Diplomacy, and Development Technology Innovation Challenge.

Avram Bar-Cohen

Avram Bar-Cohen, Principal Engineering Fellow, Raytheon- Space and Airborne Systems

Dr. Avram Bar-Cohen is an internationally recognized leader in thermal science and technology, an Honorary Member of ASME and Life Fellow of IEEE, currently serving as a Principal Engineering Fellow at Raytheon Corporation – Space and Airborne Systems. His current efforts focus on embedded cooling, including on-chip thermoelectrics, diamond substrates, and two-phase microchannel coolers for high heat flux electronic and photonic components in computational, radar, and directed energy systems.