InterPACK®

Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Conference
Aug 29 - Sept 1, 2017

Speakers

 

Track Keynote Speakers

Track 1: Heterogeneous Integration: Micro-Systems with Diverse Functionality

Session 7-1-1 Innovation and Integration; Industry – University Collaboration
Thursday, August 31, 2017
8:00AM – 9:00AM

Gilroy Vandentop

Dr. Gilroy Vandentop

Innovation and Integration; Industry — University Collaboration

Dr. Gilroy Vandentop is the Director of Corporate University Research, within Intel Labs. His team funds Intel’s university research for key internal technology and business customers. Gilroy is also on assignment at the Semiconductor Research Corporation and serves as the Executive Director of STARnet, a broad industry wide consortium. Gilroy moved to Intel Labs from TMG’s Components Research group in 2015. He formed the Novel Materials group and managed Intel’s EUV program through transfer into technology development. From 2000 to 2006, he was responsible for the Packaging Research group in Chandler, AZ. During his first 10 years at Intel, Gilroy worked in Logic Technology Development on silicon process development in the etch and photolithography areas.

Gilroy completed his Ph.D. in physical chemistry at U.C. Berkeley and his B.Sc. in honours chemistry at the University of Alberta.

Abstract: The evolution and consolidation of the semiconductor industry has made collaboration with academia more challenging and even more essential. Public- private partnerships like the SRC STARnet and JUMP programs are working examples of productive collaborative research. Some examples of key challenges and breakthroughs will be discussed along with a forward looking perspective of opportunities to continue to enhance compute capabilities by leveraging basic research resources.


Track 2: Servers of the Future

Session 7-2-1 A Systems Perspective; Making Thermal Management a 1st Class Citizen
Wednesday, August 30, 2017
9:15AM – 10:15AM

Michael K Patterson

Dr. Michael K Patterson

A Systems Perspective; Making Thermal Management a First Class Citizen

Dr. Michael K Patterson: Michael K. Patterson is a Senior Principal Engineer on the Advanced Development team of the Data Center Group at the Intel Corporation, in Hillsboro, Oregon. His current focus is in the power, thermal, and energy-efficient-performance areas of High Performance Computing. The work covers silicon level activity, through platform and rack-level solutions, and on up to interface with Data Center power and cooling technologies. He did his undergraduate work at Purdue University, received his MS degree in Management from Rensselaer Polytechnic Institute, and was awarded his MS and PhD in Mechanical Engineering from the University of Vermont. His current technical interests include super-computer architecture, server power and thermal management technologies, and high density data center concepts. He has been with Intel for 23 years. He is a registered Professional Engineer. He is a Fellow of the ASME. He is a member of ASHRAE, and served as the Research Chair for ASHRAE TC9.9, Mission Critical Facilities. He also represents Intel in a number of Green Grid Activities, most notably as the first chair of the Data Center Technology and Strategy Working Group. Dr. Patterson has been certified by the US DOE as a DCEP. He is also on the leadership team of the EE HPC WG, currently serving as the Workshop and Conferences Co-Chair.

Abstract: Thermal management is very often left to the final stages of the design work. This is true of the component, the package, and the product. The electronics design is completed based upon the expected performance goals and then the thermal engineers are asked to cool it. This all too often leads to sub-optimum designs, with cost, performance, and efficiency implications. Drawing on High Performance Computing (HPC) experiences, the impact of viewing thermal management from the system perspective is explored. Conclusions are drawn about how this view can cause the thermal aspects to move into the mainstream of the design process instead of being an afterthought. The issues are explored at all levels of the problem, from the component, to the IT equipment, up through and including the data center with positive results available at each step. Taking a system perspective can move thermal management into the heart of the design process where we can ultimately provide the best value to the end-user.


Track 3: Structural and Physical Health Monitoring

Session 7-3-1 Flexible Future: How FHE Changes the Shape of Medical, Structural Health, Asset Monitoring and Soft Robotics Applications
Wednesday, August 30, 2017
11:00AM – 12:00PM

Jason Marsh

Jason Marsh (NextFlex)

Flexible Future: How FHE Changes the Shape of Medical, Structural Health, Asset Monitoring and Soft Robotics Applications

Jason has worked in operations and engineering roles for Kyocera in the US, Japan, India, Germany, Mexico and China. As a materials science and automation engineer with a background in machine vision and industrial automation and equipment, Jason has worked on a variety of technologies from satellite applications, 3D Printing of metals and ceramics, production automation as well as advanced microelectronics and control systems. He has served on advisory boards and consulted for companies in a wide range of industries from artificial intelligence to outdoor equipment to solar power to agriculture. He is passionate about advancing electronics towards a future where function follows form and our electronics integrate into our lives seamlessly improving healthcare, infrastructure safety and reducing waste in applications like food, agriculture and industrial supply chains.

Abstract: After an introduction to NextFlex, America’s Flexible Hybrid Manufacturing Institute, and Flexible Hybrid Electronics (FHE), the speaker will identify current and emerging applications for FHE, including key target markets and the challenges that FHE can solve in healthcare, infrastructure and transportation safety, agricultural IOT, and even science fiction-worthy products such as wearable exoskeleton suits. The speaker will outline key attributes of the FHE form factor and manufacturing methods best suited for these applications, as well as critical areas of process and technology development that are currently underway to enable the next generation of these products to go to market. Lastly the speaker will focus on FHE manufacturing technologies in advanced packaging including additive conductors, flexible test methods, thin die handling, and several others.


Track 4: Energy Conversion & Storage

Session 7-4-1 Packaging Solutions to Enable High Power RF Gallium Nitride Products and Advanced Technologies
Thursday, August 31, 2017
9:15PM – 10:15PM

Quinn Martin

Quinn Martin (MACOM)

Packaging Solutions to Enable High Power RF Gallium Nitride Products and Advanced Technologies

Quinn Martin received a BS degree in Manufacturing Engineering from Brigham Young University (1998) and a Masters of Business Administration degree from Arizona State University (2002). He has been working in semiconductor packaging and assembly for over 19 years, from supporting high volume manufacturing lines to research and development of advanced materials. Mr. Martin has spent most of his career developing packaging solutions for high power RF products. He has worked with GaN devices for over 13 years, developing a portfolio of package solutions using air cavity and plastic overmold technologies. Mr. Martin is a member of the International Microelectronics and Packaging Society (IMAPS) and has co-authored several conference and journal papers.

Abstract: Gallium Nitride (GaN) technologies have been advancing for more than a decade, producing RF products with greater bandwidths, higher frequencies, and much higher power densities than other semiconductor materials. To enable the GaN device technology, innovative packaging solutions have been essential to remove heat from the device, provide appropriate matching for RF tuning, protect the device during harsh reliability tests, and many other critical features. This must all be accomplished while maintaining low packaging material and assembly costs for price-sensitive markets. In this presentation Mr. Martin will show the development of GaN technologies with an emphasis on the packaging materials and assembly processes used to make these products. He will demonstrate some of these key features with MACOM product examples and best practices in the industry. Finally, he will explain the upcoming challenges for GaN packaging and some of the advanced technologies that may be used in the future to address these challenges and further increase the performance of GaN RF products.


Track 5: Transportation: Autonomous & Electric Vehicles

7-5-1 Trends in Automotive Electronics and Sensors
Wednesday, August 30, 2017
4:15PM – 5:15PM

Jiri Marek

Dr. Jiri Marek (Bosch)

Trends in Automotive Electronics and Sensors

Dr. Jiri Marek is senior vice president of the Bosch Research and Technology Center with locations in Palo Alto, California; Pittsburgh, Pennsylvania; and Boston, Massachusetts. He was named to this position in January, 2013. Marek oversees the overall strategy, planning, operations and research direction of the centers. He is located in Palo Alto. Prior to his current position, Jiri Marek was senior vice president of engineering, sensors at Bosch Automotive Electronics Division for Robert Bosch GmbH from 2003 — 2012. In this position, he was responsible for micro-electro-mechanical systems (MEMS) activities. In November 1999, he was named vice president of engineering for restraint systems and sensors. Before that, Jiri was responsible for the Bosch Sensor Technology Center. He started his work with Robert Bosch GmbH in Reutlingen, Germany in 1987.

After a post-doctoral fellowship with IBM Research in San José, California, he was a development engineer with Hewlett-Packard’s Optical Communication Division. He received his Ph.D. from the University of Stuttgart and Max-Planck-Institut Stuttgart for his work on the analysis of grain boundaries in large grain polycrystalline solar cells. Jiri Marek studied electrical engineering at the University of Stuttgart in Germany, and at Stanford University.

Abstract: In this overview we will present the market as well as trends in automotive electronics and sensors. We will focus on vehicle dynamics control, automated driving as well as computing architectures in the automobile. MEMS sensors and their technology and applications will be presented in more detail.