InterPACK®

Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Conference
Aug 29 - Sept 1, 2017

Program - Workshops

 

InterPACK2017 will have several workshops during the week for conference attendees.

Maker Workshop: Making amazing experiences possible!

Heterogeneous Integration Technology Roadmap

Heterogeneous Integration Technology Roadmap Workshop
Friday September 1, 2017, 8:00 am to 12:00 noon

Bill Chen, ASE Fellow ASE Group
Dr. Wilmer R. Bottoms (Chairman, Third Millennium Test Solutions, Inc.)

We invite all the InterPACK participants to attend this important working session for our profession and for our industry. The workshop is open to all. It is FREE for InterPACK'17 attendees but there will be a $50 fee for attendance outside InterPACK'17.


Bill Chen

Bill Chen, ASE Fellow ASE Group

William T. Chen (M'92, SM'03, F'06) received his engineering education at University of London (B.Sc), Brown University (M.Sc) and Cornell University (PhD). He joined IBM Corporation at Endicott New York in 1963.

At IBM he worked in a broad range of IBM microelectronic packaging products. He received IBM Division President Award for his leadership and innovation in Predictive Modelling on IBM products. He was elected to the IBM Academy of Technology for his contributions to IBM Products and Packaging Technologies. He retired from IBM in 1997. He joined the Institute of Materials Research and Engineering (IMRE) in Singapore, to initiate research in microelectronic packaging materials and processes. He was appointed to the position Director of the Institute (IMRE) steering the growth in people, funding and research facilities and research direction for IMRE to become the leading materials science and engineering research center in the ASEAN region. In 2001 he joined ASE Group, where he holds the position of ASE Fellow and Senior Technical Advisor. In this assignment he has responsibilities for guidance to technology strategic directions for ASE Group. He is Senior Past President of the IEEE/CPMT Society. He is the Co-Chair of the ITRS Assembly and Packaging Roadmap Technical Working Group. He is chair of the Semicon West Packaging Committee. He has been elected to a member of the iNEMI Board. He is a member of the Technology Committee of GSA. He has been elected to Fellow of IEEE and Fellow of ASME. He has served as an Associate Editor of ASME Journal of Electronic Packaging, and IEEE/CPMT Transactions.


Wilmer Bottoms

Wilmer R. Bottoms, PhD

Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a PhD in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of many companies both public and private.

Dr. Bottoms has also served in a number of Government Advisory positions including Chairman of the Board on Assessment for NIST and a member of the Technical Advisory Committee on export controls for the US Commerce Department. Dr. Bottoms has participated in the start up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies in a wide range of industries. Among these companies are: Business Insurance Company, Chevy's Mexican Restaurants, Credence Systems, Johnny Rockets, Microelectronics Packaging Inc., NanoNexus, SBA Materials, Southwest NanoTechnologies, Tessera and Third Millennium Test Solutions. Dr. Bottoms currently serves as: Emeritus Member of the Board of Tulane University, Co-Chair of the Heterogeneous Integration Roadmap, Chairman of the SEMI's Awards Committee, Chairman of the Packaging and Package Substrates Technical Working Group for INEMI, Member of the Board of MIT's Microphotonic Center, Chairman of Fluence Analytics and Chairman of Third Millennium Test Solutions.

Abstract: Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. With the rapid migration of logic, memory and applications to the Cloud infrastructures, the Internet of Things (IoT) to internet of everything (IOE), smart devices everywhere, and autonomous automotive, the pace of innovation is increasing to meet these challenges. The Heterogeneous Integration Technology Roadmap (HIR), is sponsored by the IEEE CPMT Society, the Electron Devices Society (EDS), Photonics Society together with SEMI and ASME EPPD. It will address the future directions of heterogeneous integration technologies and applications serving the future markets and applications, so very crucial to our societies' fields of interest and to our industries and academic and research communities. In addition to Heterogeneous Integration Roadmap (HIR) two other Roadmaps are under development within IEEE: International Technology Roadmap for Wide Band-Gap Semiconductors (ITRW) sponsored by the IEEE Power Electronics Society (PELS), and International Technology Roadmap for Devices & Systems (IRDS), an IEEE Standards Association Industry Connection Program sponsored by the Rebooting Computing Initiative. Coordination initiative is underway for collaboration and harmonization among the roadmaps.