InterPACK®

Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Conference
Aug 29 - Sept 1, 2017

Program - Panel Sessions

 

Track 1 Panel: 3D Packaging

9-1-1 3D Packaging — Key Drivers, Opportunities and Challenges

Friday, September 1, 2017
11:00AM – 12:30AM

Topic Co-Organizers: Bill Bottoms, Chairman, Third Millennium Test Solutions and Kaushik Mysore, Technical Staff, AMD

Abstract: The panel discussion will focus on opportunities, challenges and key drivers for 3D Packaging.

Panelists

Eric Beyne, Program Director, 3D Systems Integration, IMEC
Dr. Eric Beyne obtained an MSc degree in Electrical Engineering in 1983 and the PhD in Applied Sciences in 1990, both from the University of Leuven (KU Leuven). He has been with imec since 1986 and holds the title of imec Fellow. Since 2004 he is the Program Director of imec's 3D System Integration program. He has been active member of the IEEE-CPMT and the IMAPS organisations and chaired or co-chaired several international conferences in the field. He received the 2016 European Semiconductor Award from Semi-Europe.

Rama Alapati, Vice President, Amkor Technology
Rama joined Amkor in 2016 and is currently responsible for the technology strategy team focused on technology innovation, pathfinding and defining technology and product roadmaps. Prior to joining Amkor, Rama led the packaging product management group at GLOBALFOUNDRIES and previously worked for Micron Technology and at IMEC as a Micron assignee. He has more than 25 granted patents, publications and invention disclosures and holds a Bachelor's degree in chemical technology from Osmania University in Hyderabad, India and a Master's in chemical engineering (honors) from the University of Kansas, Lawrence.

Gamal Refai-Ahmed, Distinguished Engineer, Xilinx
Dr. Gamal Refai-Ahmed currently is the Distinguished Engineer of thermal packaging at Xilinx, Visiting Professor, SUNY and Adjunct Professor University of Toronto. His research area of specialization is in the thermal management of electronic and optical packaging where he developed innovative electronic/optical packaging products at GE Research, AMD, PreQual Tech, Nortel, Astec-Emerson, Cisco, Ceyba and ATI Technologies . He is the author of more than 80 technical papers and 60 Patents/ pending patents. In 2010, Dr Refai has been awarded the Calvin Lecture Award and in conjunction with this latest recognition, his ASME Fellow grad was elevated to the ASME Life Fellow. He was elected as a Fellow in the Canadian Academy of Engineering, the sister Academy of the National Academy of Engineering in USA, in recognition to his leadership of promoting best electronics packaging and thermal management engineering practice in Canada.

Track 2 Panel: Servers of the Future

9-2-1 Servers of the Future

Thursday, August 31, 2017
9:15AM – 10:45AM

Topic Organizer: Michael Patterson, Senior Principal Engineer, Intel
Topic Co-Organizer: Reza Khiabani,Senior Mechanical Engineer, Google

Abstract: The panelists will present and discuss state of the art, challenges, opportunities and future directions for thermal management of high power servers.

Panelists

Mukesh Khattar, Technical Executive at EPRI
Dr. Khattar's work has earned him several ASHRAE Technology Awards, including one for the design and operation of an ultra efficient cooling system in an enterprise scale data center in 2014 and another one high density containment in 2010. His work also earned an award for Oracle in 2014 from Data Center Dynamics for Breakthrough Technologies in Data Center. He was inducted into Space Technology Hall of Fame in 1990 for his RD&D work on heat pipe technology. He served on the Board of Directors of the Green Grid from 2010-2012 and co-chaired the Energy Committee of the Silicon Valley Leadership Group from 2010-2012. He has been a voting member of the ASHRFAE TC9.9 that is focused on data centers mission critical facilities.

Sukhvinder Kang, Chief Technology Officer at Aavid
Dr. Kang joined Aavid Thermalloy in 2000 as its Chief Technology Officer. Before joining Aavid Thermalloy, Mr. Kang was a senior engineer at IBM's server division which he joined in 1991. He served on the IBM Academy of Technology's team on low temperature cooling of future computer systems. From 1985 to 1991 he was a R&D project engineer at Creare Inc. Mr. Kang has over 20 years of industry experience developing unique thermo-fluid solutions encompassing electronics cooling, space, defense, nuclear and oil exploration applications. He holds over 10 patents, has authored and co-authored over 20 technical papers and has lectured several seminars and professional courses in electronics cooling. Mr. Kang graduated from the Indian Institute of Technology with a bachelor and masters in Mechanical Engineering. He received his Ph. D in Heat Transfer from the University of Minnesota, Minneapolis.

Steve Branton, Senior Director for Data Center Solutions at Asetek
Steve Branton is Senior Director for Data Center Solutions at Asetek, a leading provider of liquid cooling solutions for data centers. In this role he is responsible for guiding the development of energy efficient liquid cooling products that enable data centers to operate high power servers. He holds several patents in the field of liquid cooling, and has a BS degree in Business Administration from California State University, Northridge and a MBA from Eastern Washington University.

Track 3 Panel: Structural and Physical Health Monitoring

9-3-1 Flexible Hybrid Integration Challenges and Opportunities

Wednesday, August 30, 2017
2:15PM – 3:45PM

Panel Moderator: Valerie Marty, Connected Micro LLC, OR
Valerie Marty is the founder of Connected Micro LLC providing consulting services for research teams navigating commercialization challenges. Valerie contributed to the advancement of CMOS and MEMS technologies at Hewlett Packard as an R&D engineer and later became the Global Technical Communities Lead for HP Labs. In 2014, Valerie became a Hall of Fame Inductee within the MEMS & Sensors Industry Group and an alumni of the MSIG Technical Advisory Committee. Valerie holds an MS in Physical Chemistry from Oregon State University.

Abstract: Systems integration breakthroughs are enabling emerging applications of flexible electronics across multiple markets. This multi-disciplinary panel will share their experience in research, technology development, systems integration and novel manufacturing methods while driving capabilities forward to address key commercialization challenges. Perspectives in biosensing and aerospace applications, systems research approaches in academia and the need for collaboration across the advanced microelectronics industry supply chain will be shared.

Panelists

Dr. Anwar Mohammed, Flex, CA
Dr. Anwar Mohammed is the Senior Director at Flex responsible for the World Wide development of Advanced Assembly, Test and Wearable Technologies. The group defines, develops and deploys leading edge technologies to multiple Flex sites located in over 30 countries. Amongst other responsibilities, Anwar is responsible for developing state of the art, core technology blocks for the fast emerging Wearable Technology (WT) Market, including the development of technologies for IoT, Smart Garments, Consumer Health and Stretchable Electronics (SE). He is the author of over 40 patents and is an IMAPS Fellow and a NextFlex Fellow.

Dr. Benjamin Leever, Soft Matter Materials Branch, Air Force Research Laboratory, OH
Benjamin is currently a Senior Materials Engineer AFRL Soft Matter Materials Branch. His primary roles are Advanced Development Lead and Government Chief Technology Officer of NextFlex, a $170M public-private partnership established to create a domestic manufacturing ecosystem in flexible hybrid electronics. He earned a B.S. in Chemical Engineering from the University of Cincinnati and a Ph.D. in Materials Science & Engineering from Northwestern University.

Ramune Nagisetty, Senior Principal Engineer, Anticipatory Computing Lab, Intel, OR
Ramune currently leads research in wearable computing with a focus on wearable authentication, wearables for emotional connection, and printed flexible electronics. Ramune earned a BSEE from Northwestern University in 1991 and an MSEE specializing in solid state physics from the University of California, Berkeley in 1995. She delivered Intel's first strained silicon technology to manufacturing and did pathfinding for Hi-K Metal Gate and Tri-gate (FinFET) transistors. She has authored nine technical publications and has fifteen issued or pending patents related to device physics, high performance process technology, and wearable technology usage models. In 2008 she received the Emerging Leader Award from the Society of Women Engineers.

Dr. Fu-Kuo Chang, Professor for Aeronautics and Astronautics, Stanford, CA
Professor Chang's primary research interest is in the areas of multi-functional materials and intelligent structures with particular emphases on structural health monitoring, intelligent self-sensing diagnostics, and integrated health management for space and aircraft structures as well safety-critical assets and medical devices. His specialties include sensors and sensor network development, built-in self-diagnostics, & integrated diagnostics and prognostics, damage tolerance and failure analysis for composite materials, and advanced multi-physics computational methods for multi-functional structures.

Track 4 Panel: Energy Conversion & Storage

9-4-1 Wide-Bandgap Packaging, Thermal Management and Applications

Thursday, August 31, 2017
4:15PM – 5:45PM

Topic Organizer: Lauren Boteler, U.S. Army Research Lab
Dr. Lauren Boteler has 12 years experience in power electronics packaging, integrated thermal management, stacked power devices, transient thermal mitigation, additively manufactured parts, multi-functional components, and high-voltage operation.

Topic Co-Organizer: Patrick McCluskey, University of Maryland
Prof. Patrick McCluskey has 30 years experience in power electronics packaging and design for reliability. He is the author/co-author of over 150 papers and 3 books. He serves as the Technical Chair of power electronics packaging workshops included the 3D-PEIM

Abstract: The panelists will present and discuss state of the art, challenges, opportunities and future directions for wide-bandgap-device-based packaging (including silicon carbide and gallium nitride), thermal management and applications across a wide range of energy efficiency and renewable energy applications.

Panelists

Isik Kizilyalli, Program Director, ARPA-E
Dr. Isik C. Kizilyalli currently serves as a Program Director at the Advanced Research Projects Agency – Energy (ARPA-E), Department of Energy. Kizilyalli's focus at ARPA-E includes high efficiency power conversion, reliable power electronics for extreme environments, solar PV, instrumentation for intrinsically safe nuclear energy, and enhanced geothermal systems.

David Reusch, Executive Director of Applications Engineering, Efficient Power Conversion
Dr. David Reusch is currently the Executive Director of Applications Engineering at Efficient Power Conversion Corporation (EPC). He has been with the company since 2012 and is located in Blacksburg, Virginia.

Avram Bar-Cohen, Principal Engineering Fellow, Raytheon- Space and Airborne Systems
Dr. Avram Bar-Cohen is an internationally recognized leader in thermal science and technology, an Honorary Member of ASME and Life Fellow of IEEE, currently serving as a Principal Engineering Fellow at Raytheon Corporation – Space and Airborne Systems. His current efforts focus on embedded cooling, including on-chip thermoelectrics, diamond substrates, and two-phase microchannel coolers for high heat flux electronic and photonic components in computational, radar, and directed energy systems

Douglas Hopkins, Professor, North Carolina State University
Dr. Douglas Hopkins is a professor in Electrical and Computer Engineering, Director of the Laboratory for Packaging Research in Electronic Energy Systems (PREES), part of the FREEDM Systems Center, and is an affiliate faculty member in the Center for Additive Manufacturing and Logistics CAMAL, at North Carolina State University.

Ty McNutt, Director of Business Development, Wolfspeed
Dr. Ty McNutt currently serves as Director of Business Development for the Fayetteville, Arkansas location of Wolfspeed, a Cree Company, where he is responsible for domestic and international business activities. He manages various technical projects, and works closely with customers and their applications teams to integrate advanced wide bandgap device and packaging technologies into next generation systems.

John Oenick, Manager, Hybrid Vehicle System Development, John Deere
Mr. John Oenick Manages Hybrid Vehicle System Development for John Deere as part of the Corporate Electric Drive Engineering Services Group. He is the former Director of Power Electronics for John Deere Electronic Solutions. He has 30 years of experience in vehicle powertrain and electric drive development with Deere and the Automotive Industry.

Track 5 Panel: Transportation — Autonomous & Electric Vehicles

9-5-1 Next-Generation Automotive Electronics: Reliability Challenges

Thursday, August 31, 2017
4:15PM – 5:45PM

Topic Organizer: Dr. Przemyslaw Gromala, Robert Bosch GmbH, Przemyslaw Gromala is a simulation senior expert and simulation team leader at Robert Bosch, Automotive Electronics in Reutlingen. His research activities focus on implementation of the simulation driven design for transmission control modules and multi-chip power packaging. His technical expertise includes Virtual DoE, material characterization, physics of failure simulation, verification techniques and prognostics and health management. Prior joining Bosch Mr Gromala worked at Delphi in Krakow, as well as at Infineon in Dresden. He holds a PhD in mechanical engineering from Cracow University of Technology in Poland.

Topic Co-Organizer: Prof. Pradeep Lall, Auburn University, Pradeep Lall is the MacFarlane Endowed Professor with the Department of Mechanical Engineering, Director of the NSF-CAVE3 Electronics Research Center, and Director of the Harsh-Node of NextFlex Manufacturing Institute at Auburn University. He is author and co-author of 2-books, 14 book chapters, and over 500 journal and conference papers in the field of electronics reliability, safety, energy efficiency, and survivability. Dr. Lall is a fellow of the ASME, fellow of the IEEE, a Fellow of the Alabama Academy of Science. He is recipient of the NSF-IUCRC Association's Alex Schwarzkopf Prize for Technology Innovation, Alabama Academy of Science's Wright A. Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, SMTA's Member of Technical Distinction Award, Auburn University's Creative Research and Scholarship Award, SEC Faculty Achievement Award, Samuel Ginn College of Engineering Senior Faculty Research Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and Twenty Best-Paper Awards at national and international conferences.

Abstract: Connectivity, automation and electrification are the three trends that drive development of an automotive electronics. Entire society will benefit from these trends; yet, a lot of innovations are required to solve numerous unknown challenges. Connectivity and automation will require significant changes in existing ECU technologies. For autonomous driving, soon traditional ECU will be exchanged by smart systems 3rd generation that will perform human-like perception. Electrification will revolutionize entire powertrain units and required road infrastructures. Slowly, combustion engines will decrease their market share. Power electronics will be one of the key driver in the development of the microelectronics industry. For instance, utilizing SiC and silver sintering will increase the efficiency of power electronics and will raise the maximum operational temperature. New encapsulating materials are required to fulfill these new requirements. Finally, nano and microelectronics systems will have to be developed in a shorter time and at a lower cost. In this panel, representatives from both, academia and industry will share their perspective for the next generation automotive electronics for application in autonomous and electrified cars. Main focus will be on the reliability aspects, and new approaches required to fulfill customer expectations.

Prof. Sven Rzepka, Fraunhofer ENAS, Head of Micro Materials Center Sven Rzepka is head of the Micro Materials Center (MMC), the reliability and materials research department of Fraunhofer ENAS and professor for 'smart systems reliability' at TU Chemnitz, Germany. He joined Fraunhofer in 2009 after working as Principal simulation at Qimonda, Backend development, and at Infineon, BEoL reliability department. In 2002, he graduated from Dresden University of Technology with PhD and habilitation degrees. In total, Dr. Rzepka has been working in BEoL and packaging technologies for 30 years with 25 years of experience in microelectronics and smart systems reliability testing and simulation. He is long-term member of IEEE and EPoSS. He has published his work in more than 200 papers in international journals and at conferences around the world.

Prof. Bongtae Han, Center for Advanced Life Cycle Engineering (CALCE), University of Maryland Dr. Bongtae Han received his BS and MS degrees from Seoul National University in 1981 and 1983, respectively, and his Ph.D. degree in Engineering Mechanics from Virginia Tech in 1991. Dr. Bongtae Han is Keystone Professor of Engineering and APT Chair of the Mechanical Engineering Department of the University of Maryland; and is currently directing the LOMSS (Laboratory for Optomechanics and Micro/nano Semiconductor/Photonics Systems) of CALCE (Center for Advanced Life Cycle Engineering). Dr. Han has co-authored a text book entitled "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials", Springer-Verlag (1997) and edited two books. He has published 12 book chapters and over 250 journal and conference papers in the field of microelectronics, photonics and experimental mechanics. He holds 2 US patents and 4 invention disclosures.

Matt Romig, Texas Instruments, Semiconductor Packaging Roadmap and Business Interface Manager. Matt Romig has worked in various packaging roles at Texas Instruments since 2000. Most recently Matt has focused on packaging technologies and roadmaps for analog and power devices across a range of end applications and circuit functions. Matt has a BSME degree from Iowa State University and is working on an MSEE degree from the University of Southern California. Matt enjoys innovative and cross-functional challenges and holds 15 US patents

Mohak Shah, PhD, Robert Bosch LLC, Head of data science, AI research Mohak Shah is an analytics leader with over 15 years of experience in organization formation, strategy, and end-to-end data science and AI engagements. He has led initiatives in domains including automotive, aviation, energy and healthcare managing diverse teams from research, software and businesses. As a scientist, Mohak has developed novel machine learning and statistical algorithms with high impact business applications. He is the author of "Evaluating Learning Algorithms: A Classification Perspective" (Cambridge), and has published more than 45 research articles, in top conferences and journals in the analytics space, and patented technologies. He was the General Chair of the ACM SIGKDD 2016 conference and also holds an Adjunct Research Professor position with the University of Illinois at Chicago. He regularly participates in scientific, business, and investment communities as expert speaker, advisor and consultant.

Dr. Shalabh Tandon, Intel, Director IoTG Product Quality & Reliability. Shalabh Tandon is the Director of Internet of Things (IOT) Product Q&R group that is responsible for qualifying products for this emerging market. The IOT division at Intel services the embedded, retail, industrial markets as well as the expanding automotive (ADAS or fully autonomous) markets where computational needs and workload complexities are increasing at a rapid pace.

Shalabh joined Intel in 1997 in the packaging quality and reliability group. Over his ~19 years at Intel, Shalabh has worked in the Corporate Quality Network (CQN) serving various functions. His tenure has included responsibilities in understanding thermomechanical behavior of polymers in semiconductors, especially from a reliability perspective; testing of product performance and quality using various functional sockets and semiconductor qualification strategies for various usage models. His current focus is both understanding the usage of semiconductors in the IOT space, especially automotive industry, and ensuring the products needed for these evolving markets are capable of meeting customer's computational and quality and reliability needs.

Shalabh holds a MSc in Chemistry from University of Pittsburgh & a Ph.D in Polymer Science & Engineer from University of Massachusetts, Amherst. He has published several technical articles and has a few patents pending.

Yoshikazu Takahashi, Fuji Electric Co., Ltd, Senior Chief Engineer. Yoshikazu Takahashi received the B.E. degree in materials science and engineering from Waseda University, Tokyo, Japan, in 1982, and the PhD degree in electrical and electronic engineering from the University of Yamanashi, Kofu, Japan, in 1998.

He joined Fuji Electric Company, Ltd., Japan in 1982, where he has been mainly developing various High Power IGBT Modules for High Speed Trains, Hybrid Cars, Mega Solar Power Control Units, etc. He is now a Senior Chief Engineer with the Development Division since 2016. He is head of the Next Generation Power Module research and SiC-packaging research. He is currently Visiting Professor of Graduate School, University of Yamanashi, Visiting Senior Researcher of Waseda University, and Representative Director of Institute for Advanced Micro-System Integration Inc. (IMSI), Tokyo, Japan.

Azeem Sarwar, General Motors, Senior Researcher Diagnostics and Prognostics. Dr. Sarwar received his Bachelor’s Degree in Mechanical Engineering with highest honors from National University of Sciences and Technology, Pakistan, in 2000 receiving President’s, as well as, Commandant’s gold medals. He then worked in the energy sector for about 4 years working as a consultant for various oil and gas exploration and production companies and regulatory authorities before starting his graduate studies at the University of Illinois at Urbana Champaign. From Illinois, Dr. Sarwar received a Master’s Degree in Mechanical Engineering in 2006, a Master’s Degree in Mathematics in 2008, and a PhD in Mechanical Engineering in 2009. After graduating from Illinois, he worked as a Research Fellow at the University of Maryland College Park with the Institute of Systems Research. Since 2014, Dr. Sarwar has been working as a Senior Researcher at General Motors Research and Development Center where he is developing prognostic technologies for automotive applications, and have filed more than 15 Records of Invention so far. Dr. Sarwar is a recipient of the Canadian Commonwealth Scholarship and the NSF IGERT Fellowships. He has made numerous national and international presentations about his work. His work has featured in one book chapter, three invited journal articles, and more than 25 peer reviewed articles.

9-6-1 Women in STEM Education Panel

Wednesday, August 30, 2017
2:15PM – 3:45PM

Panel Organizers and Moderators: Professor Debbie G. Senesky, Stanford University, Professor Amy Marconnet, Purdue University

The organizing committee of InterPACK is delighted to announce that there will be a panel discussion on “Women in STEM Education” held at the 2017 InterPACK conference at the Fairmont San Francisco Hotel in San Francisco, California. The panel will be composed of exemplary female educators that will discuss their career paths, as well as hot topics in STEM (science, technology, engineering and math) education. The panel will have representation from a wide range of educators and educational leaders at the K-12, community college, and university levels. All graduate students, and particularly those who participate in the graduate student poster session, will be strongly encouraged to attend and learn about potential careers in academia. In addition, the event will be advertised to attendees from industry, government, and academia to have a wide range of inputs during the question and answer period. The biographies of our panelists can be found below.

Dr. Tsu-Jae King Liu (University of California at Berkeley) Tsu-Jae King Liu was born in Ithaca, NY and raised in the San Francisco Bay Area. She earned her B.S., M.S. and Ph.D. degrees in Electrical Engineering from Stanford University in 1984, 1986 and 1994, respectively. In August 1996 she joined the faculty of the University of California at Berkeley, where she now holds the TSMC Distinguished Professorship in Microelectronics in the Department of Electrical Engineering and Computer Sciences (EECS). From 2000 to 2004 and from 2006 to 2008, she served as the Faculty Director of the UC Berkeley Microfabrication Laboratory. From 2003 to 2004, she also served as Vice Chair for Graduate Matters in the EECS Department. In 2004-2006 she was Senior Director of Engineering in the Advanced Technology Group of Synopsys, Inc. (Mountain View, CA). From July 2008 through June 2012 she was Associate Dean for Research in the College of Engineering. From July 2012 through June 2016 she was Chair of the Electrical Engineering Division, and from July 2014 through June 2016 she was Chair of the EECS Department. From July 2016 through September 2016 she served as Associate Dean for Academic Planning and Development in the College of Engineering. Since October 2016 she has been serving as Vice Provost for Academic and Space Planning. Her research activities are presently in nanometer-scale logic and memory devices, and advanced materials, process technology, and devices for energy-efficient electronics. She has authored or co-authored over 500 publications and holds over 90 patents.

Dr. Sarah Parikh (Foothill College). Sarah Parikh is a professor at Foothill College teaching a variety of courses in the Physics and Engineering Departments and is currently the Department Chair for the Engineering Department. She has led initiatives to foster sense of community at Foothill College including the STEM Newsletter, STEM Day, STEM Showcase, the Engineering Speaker Series, and the Leadership Lunch speaker series. Sarah's research interests include: engineering pathways to, through, and beyond community college; the development of belonging and identity as an engineering student and engineer; and measures of success for community college transfer programs. Professor Parikh has a Ph.D. from Stanford University in Mechanical Engineering, studying Engineering Education.

Dr. Fatima Alleyne (Contra Costa County Board of Education) Dr. Fatima S. Alleyne (Contra Costa County Board of Education). Dr. Fatima Alleyne is the Education Advisor for the Center for Restorative Solutions and Contra Costa County Board of Education Area 1 Trustee. She also serves as Clerk for the County Board and is the Alameda/Contra Costa County representative for the California School Boards Association (CSBA) Delegate Assembly and California County Boards of Education (CCBE) Board of Directors. In her capacity as CSBA Delegate and CCBE Board member, she provides policy direction for the association that meets the best interests of school districts and county offices throughout the state of California and advocates on behalf of children, public education, and local boards. Dr. Alleyne received her Ph.D. in Materials Science and Engineering from the University of California, Berkeley.

Ms. Courtenay Carr Heuer (Scientific Adventures for Girls). Courtenay Carr Heuer is a Co-Founder of Scientific Adventures for Girls (SAFG). SAFG provides after school and summer STEM (science, technology, engineering and math) programs for young children with a special focus on girls and disadvantaged youth. SAFG's mission is to keep kids, starting at the age of 5, engaged in STEM - either as professionals in STEM fields or as contributing members of the global community with a strong background in technological skills and scientific methods. Courtenay has her B.A. degree in Sociology from the University of California, Berkeley and her M.A. degree in Commercial Diplomacy from the Monterey Institute of International Studies.