InterPACK®

Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Conference
Aug 28 - Aug 30, 2018
Exhibition
Aug 29 - Aug 30, 2018

Program

 

  • Track 1: Heterogeneous Integration
  • Track 2: Servers of the Future
  • Track 3: Structural and Physical Health Monitoring
  • Track 4: Power Electronics, Energy Conversion and Storage
  • Track 5: Autonomous, Hybrid and Electric Vehicles
  • Track 6: Industry, Government Lab and Academia Posters
  • Track 7 :Women in Engineering Panel
  • Track 8: Keynotes
  • Track 9: Graduate Students Workshop
  • Track 10: Committee Meetings

Paper Submission:
Authors should submit a tentative title/abstract to begin the paper submission process. Authors should then submit full-length manuscripts for peer review. Draft manuscripts and final-paper submissions must conform to ASME publication guidelines.

Social Program:
Complementing this year’s technical program will be a robust social program including a reception, and networking opportunities. Select meals will also be provided.

Once Abstracts acceptance is complete the Program widget will be added and this will pull information from the Conference Toolbox. This would include; tracks, sessions, committee meetings, tours, lunch, dinners, receptions, etc.