InterPACK®

Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Conference
Aug 29 - Sept 1, 2017

About

 

About IPAK

The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is the flagship conference of the Electronics and Photonics Packaging Division (EPPD), in technical co-operation with the Japanese Society of Mechanical Engineering (JSME).

About ASME

ASME is a not-for-profit membership organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines, toward a goal of helping the global engineering community develop solutions to benefit lives and livelihoods. Founded in 1880 by a small group of leading industrialists, ASME has grown through the decades to include more than 140,000 members in 151 countries.

For more than 100 years, ASME has successfully enhanced performance and safety worldwide through its renowned codes and standards, conformity assessment programs, training courses, and journals.

ASME also produces nearly 40 international conferences. These industry-leading events feature advanced research and technical content spanning a range of industries impacted by mechanical engineering, including energy production, energy sources, advanced manufacturing, and engineering sciences. View all ASME Conferences.