88751C - Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack2023) has been added to your cart.

Proceedings

Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPack2023)

Name: 2017 Proceedings of the ASME 2017 InterPack Conference (IPACK2017)
Brand: The American Society of Mechanical Engineers

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Focuses on R&D, manufacturing, and application for packaging and integration of electronic and photonic systems, MEMS, and NEMS, the proceedings cover the latest research and emerging technologies.

Topics

Heterogeneous Integration of Electronic Packages
Data Centers, Servers of the Future, Edge and Cloud Computing
Flexible and Wearable Electronics
Power Electronics
Multiscale Heat Transfer in Optics and Energy Systems
Autonomous, Hybrid, and Electric Vehicles
Reliability of Electronic Packages and Systems
Nano-Scale Thermal Transport and Materials