ISPS/MIPE 2018

Information Storage and Processing Systems and Micromechatronics for Information and Precision Equipment

Hilton San Francisco Financial District, San Francisco, CA

Conference
August 29 - 30, 2018

 

The 27th ASME Annual Conference on Information Storage & Processing Systems (ISPS)

The 27th ASME Annual Conference on Information Storage and Processing Systems (ISPS 2018) to be held in San Francisco, California, USA, from August 29-30, 2018. Again for this year, the ISPS2018 is co-located with ASME's InterPACK 2018 conference.

This event is intended to provide a forum for international researchers from the academia and industries to share their findings, to network, and to foster collaboration opportunities in technical and business areas. It is also intended to attract and groom graduate students in the ISPS technical area and related industries.

The conference focuses on information storage and processing systems, as well as intelligent and precision equipment. The target markets include but not limited to: hard disk drive, optical storage systems, biomedical equipment, intelligent machines, consumer electronics, storage systems, imaging and printing equipment. Researchers are working towards enhancing the functionality of the said systems and equipment, making them more powerful (faster in operation, etc), user-friendly, robust and reliable, and environmentally friendly.

The multinational companies in the US and Japan (e.g., WD, HGST, Seagate, HP, TDK, etc.) are among the main R&D drivers, whereas in Korea and Singapore, there are national laboratories (Center for Information Storage Device at Yonsei University and the Data Storage Institute in Singapore, respectively) working in this area.

The ISPS conference attracts approximately 100 attendees each year with over 80 technical presentations.

ISPS’ 17 is soliciting 3-page papers for each of the technical tracks outlined below. Papers accepted and presented will be published in the official conference proceedings. The conference includes keynote and invited speaker presentations.

We look forward to seeing you to San Francisco, CA in August 2018!

Conference Features

ISPS2018 offers the following features:

  • One Best Paper Award for each technical track.
  • One Best Student Paper Award.
  • Two ISPS Division Graduate Student Fellowships in the form of USD 2,500 each and registration fee waiver.
  • Six Conference Scholarships for graduate students in the form of registration fee waiver.
  • Discounted registration fees for ASME members and students, respectively.
  • Conference supported by ASME centralized web hosting and paper submission handling process.
  • GoGreen initiative to use online access of conference materials (on-site WiFi access provided).

Fellowship and scholarship Award application

Deadline: June 1st 2018
Support materials: ISPS/MIPE final paper, resume, one reference letter and one page research statement. Please send your application materials to Dr. Shaomin Xiong (shaomin.xiong@wdc.com)

Co-Located Events

InterPACK

 

Important Dates

 

Submission of Full-Length Paper for Review
April 16, 2018

Author Paper Review Complete/Paper Acceptance Notification
May 1, 2018

Submission of Copyright Form
May 15, 2018

Submission of Final Paper
May 18, 2018

Fellowship & Scholarship Application
June 1, 2018

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