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Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Aug 29 - Sept 1, 2017

Speakers - Invited Sessions


Track 1: Heterogeneous Integration; Microsystems with Diverse Functionality 1-2-3 New Frontiers in Materials – II
Thursday, August 31, 2017
11:00AM – 12:30PM
Session Organizer and Moderator: Prof. Ganpati Ramanath, Dr. Kaushik Mysore

Pawel Keblinski

Dr. Pawel Keblinski, Rensselaer Polytechnic Institute

Professor Keblinski received his Ph.D. from the Pennsylvania State University in 1995. Before he joined Rensselaer in 1999 he was a postdoctoral researcher at Argonne National Laboratory and worked at Forschungszentrum Karlsruhe in Germany as a recipient of an Alexander von Humboldt Fellowship. Professor Keblinski is an author or co-author of 129 papers on topics ranging from mesoscopic-level modeling of vapor deposition and phase separation to atomic-level structure and properties of interfaces in metals, covalent materials and ionic ceramics. Professor Keblinski's work is focused on the relationship between microstructure and various materials properties, such as mechanical response, diffusion, interfacial migration and phase diagram, in particular, of nano-structured materials. A major goal of Professor Keblinski's work is to design and analyze computational models in order to gain insights into the nature of the material behavior and properties. These insights are than used to formulate theoretical concepts, to understand experimental results and to guide future experiments. Other interests include connecting atomic-level modeling with electronic-level studies as well as with the macroscopic description of the material based on constitutive models.

Heat and Interfaces in Electronic Materials: An interface between two materials poses a resistance to the heat flow, which is addition to the resistance of the bulk of the material. Consequently, materials with high density of interfaces, such as supperlattices, nanocrytalline materials, and nanocomposites, can exhibit thermal conduction that is far lower than values characterizing bulk materials with little or no interfaces. Such thermal conductivity reduction can be advantageous, e.g., in the case of thermal barrier coatings or thermoelectric materials, or detrimental, when the objective is to enable efficient heat dissipation, as is the case for thermal interface materials. In my presentation I will discuss factors determining heat flow across interfaces and the ability of the atomic-level simulation and calculation techniques to shed light on the relative role of these factors, and the relationship between interfacial structure and bonding and interfacial thermal resistance. Aimed with this information and predictions of the continuum-level homogenization theories, I will discuss design principles and for nanocomposite materials with good, or even superior, thermal transport properties. Finally I will address the role of the liquid-vapor interface in high-power density evaporative cooling applications.

Theodorian Borca-Tasciuc

Dr. Theodorian Borca-Tasciuc, Rensselaer Polytechnic Institute

Dr. Theodorian (Theo) Borca-Tasciuc has started his academic career in 2001 at Rensselaer Polytechnic Institute and since 2013 he is a full professor. He is the director of the Nanoscale Thermophysics and Energy Conversion Laboratory (NanoTEC) on the Rensselaer campus. He received the NSF CAREER award (2004), School of Engineering Outstanding Team award (2013), is an associate editor for the Journal of Nanomaterials, a member of the ASME's K8 committee on Fundamentals of Heat Transfer, an invited member of the nascent ASME's K-9 committee on Nanoscale Thermal Transport, and on the international advisory board of CIMTEC conferences. He has organized and chaired multiple symposia and sessions on nanoscale thermal transport and energy conversion with ASME and MRS. Since January 2015, Dr. T. Borca-Tasciuc serves as the Associate Department Head for Graduate Affairs and the Mechanical Engineering Program Director for the MANE Dept. He authored >85 journal articles with >3600 citations, and h-index of 31.

Novel Approaches to Measuring and Controlling the Thermal Properties of Nanomaterials: The talk will focus on thermal transport investigations in polymer based nanocomposites exhibiting unparalleled thermal conductivities, along with recent advances in scanning probe techniques for quantitative determination of thermal properties with high spatial resolution. Proof-of-concept polymer nanocomposites are presented and several successful strategies are discussed that enhance their thermal conductivities through aligning, sintering, and controlling the aspect ratio of the fillers. These strategies open new opportunities for fast and low-temperature processing of polymeric packaging materials and with independently controlled viscosity and thermal properties. In one set of novel composite materials, formation of high aspect ratio nanoscale tree-shape silver networks in epoxy, at low temperatures (<150 °C) and atmospheric pressures, induces a 200 fold enhancement of compo-site thermal conductivity k compared to the matrix. The networks form through a three-step process comprising of self-assembly by diffusion limited aggregation of polyvinylpyrrolidone (PVP) coated nanoparticles, removal of PVP coating from the surface, and sintering of silver nanoparticles in high aspect ratio networked structures. By controlling the self-assembly and sintering in carefully designed temperature and time processing steps leads to ? of our silver nanocomposites that is up to 300% the value of the present state of the art polymer nanocomposites at similar volume fractions. While these networks were demonstrated at volume fractions >10%, an alternate strategy for lower filler fractions? 0.04 shows in situ microwave-welding of Ag nanowire fillers in polydimethylsiloxane (PDMS). This method yields up to a 40-fold increase in k vs the polymer matrix without degrading the polymer. Such k enhancements are at least tenfold higher than obtained with similarly low filler fractions of non-connected carbon nanotubes, graphene, or metallic fillers. Additionally, the composites exhibit remarkable compliance that is about fourfold lower than that of unfilled PDMS, due to inhibited crosslinking resulting from nanowire interconnectivity. An estimation of the temperatures needed for nanowires welding indicates the heating is localized to overlapping nanowire junctions. Other mecha-nisms to control the alignment of nanofillers in composites or heat transfer under external fields are discussed, including aligning nanowires inside patterned block copolymers and gating heat transport in magnetic nanofluids. The discussion on recent thermal metrology advances will focus on quantitative scanning thermal microscopy for non-contact, accurate measurements of thermal conductivity. New calibration strategies, coupled with analytical modeling are validated by extensive three-dimensional numerical analysis performed over a wide range of samples thermal conductivities, yielding a robust scanning thermal characterization technique and new opportunities for fast accurate spatially resolved characterization of packaging materials and structures.

Track 1: Heterogeneous Integration; Microsystems with Diverse Functionality
1-2-2 New Frontiers in Materials – I
Thursday, August 31, 2017
9:15AM – 10:45AM
Session Organizer and Moderator: Prof. Ganpati Ramanath, Dr. Kaushik Mysore

This invited session will focus on tailoring novel multifunctional thin film, bulk and nanomaterials and interfaces with control over multiple properties for emergent and conventional applications in electronics packaging.

Mark Hersam

Dr. Mark Hersam, Northwestern University

Mark C Hersam, I'm Professor of Materials Science and Engineering, Chemistry, and Medicine and currently hold the Bette and Neison Harris Chair in Teaching Excellence at Northwestern University. My research interests include nanofabrication, scanning probe microscopy, semiconductor surfaces and carbon nanomaterials. The paper is based on research that was completed when I was a PhD student in the laboratory of Professor Joseph W Lyding at the University of Illinois at Urbana-Champaign. Dr Nathan P Guisinger was an undergraduate researcher at the time. Professor Lyding and Dr Guisinger remain active researchers today at the University of Illinois at Urbana-Champaign and Argonne National Laboratory, respectively.

Processing and Applications of Two-Dimensional Nanomaterial Inks: Two-dimensional nanomaterials have emerged as promising candidates for next-generation electronics and optoelectronics [1,2], but advances in scalable nanomanufacturing are required to exploit this potential in real-world technology. This talk will explore methods for improving the uniformity of solution-processed two-dimensional nanomaterials with an eye toward realizing dispersions and inks that can be deposited into large-area thin-films [3]. In particular, density gradient ultracentrifugation allows the solution-based isolation of boron nitride [4], montmorillonite [5], and transition metal dichalcogenides (e.g., MoS2, WS2, ReS2, MoSe2, WSe2) [6,7] with homogeneous thickness down to the atomically thin limit. Similarly, two-dimensional black phosphorus is isolated in organic solvents [8] or deoxygenated aqueous surfactant solutions [9] with the resulting phosphorene nanosheets showing field-effect transistor mobilities and on/off ratios that are comparable to micromechanically exfoliated flakes. By adding cellulosic polymer stabilizers to these dispersions, the rheological properties can be tuned by orders of magnitude, thereby enabling two-dimensional nanomaterial inks that are compatible with a range of additive manufacturing methods including inkjet [10], gravure [11], screen [12], and 3D printing [13]. The resulting printed two-dimensional nanomaterial structures show promise in several applications including photodiodes [14], anti-ambipolar transistors [15], gate-tunable memristors [16], and heterojunction photovoltaics [17,18].

Rampi Ramprasad

Dr. Rampi Ramprasad, University of Connecticut

Prof. Ramprasad received his B. Tech. in Metallurgical Engineering at the Indian Institute of Technology, Madras, India, an in Materials Science & Engineering at the Washington State University, and a Ph.D. degree also in Materials Science & Engineering at the University of Illinois, Urbana-Champaign. After a 6 year stint with Motorola's R&D laboratories at Tempe, AZ, he joined the Department of Materials Science & Engineering at the University of Connecticut in the Fall of 2004. Prof. Ramprasad's area of expertise is in the development and application of first principles and data-driven computational tools, and more broadly in the utilization of such methods for the design and discovery of new materials, especially dielectrics and catalysts. He has authored or co-authored over 150 peer-reviewed journal articles, 4 book chapters and 4 patents. Prof. Ramprasad is an elected member of the Connecticut Academy of Science and Engineering, a Fellow of the American Physical Society, and the recipient of the Alexander von Humboldt Fellowship, the Max Planck Society Fellowship for Distinguished Scientists, the United Technologies Corporation Professorship for Engineering Innovation, and a Centennial Term Professorship.

Rational Computation-Guided Design of Polymer Dielectrics: To date, trial and error strategies guided by intuition have dominated the identification of materials suitable for a specific application. We are entering a data-rich, modeling-driven era where such Edisonian approaches are gradually being replaced by rational strategies which couple predictions from advanced computational screening with targeted experimental synthesis and validation. Consistent with this emerging paradigm, we propose a strategy of hierarchical modeling with successive down-selection stages to accelerate the identification of polymer dielectrics that have the potential to surpass "standard" materials for a given application. Specifically, quantum mechanics based combinatorial searches of chemical and configurational spaces, supplemented with data-driven (machine learning) methods are used. These efforts have led to the identification of several new organic polymer dielectrics within known generic polymer subclasses (e.g., polyurea, polythiourea, polyimide), and the recognition of the untapped potential inherent in entirely new and unanticipated chemical subspaces offered by organometallic polymers. The challenges that remain and the need for additional methodological developments necessary to further strengthen this rational collaborative design concept are then presented.