NOTE: This isInterPACK 2017
check out InterPACK 2018

InterPACK®

Packaging and Integration of Electronic and Photonic Microsystems

Hilton San Francisco Financial District, San Francisco, CA

Conference
Aug 29 - Sept 1, 2017

Speakers - Achievement Award

 

MetaMaterials for Thermal Management

Kenneth E. Goodson

Kenneth E. Goodson
Davies Family Provostial Professor
Bosch Department Chairman
Stanford Mechanical Engineering
nanoheat.stanford.edu

Abstract: Thermal management is critical for electronic systems ranging from servers and smartphones to radar HEMTs and hybrid vehicle converters. Some great research progress is being achieved through thermal metamaterials, which offer unusual combinations of thermal, mechanical, fluidic, and other properties by means of micro- or nanoscale heterogeneity, porosity, and/or layering. This talk summarizes our efforts in this area with an emphasis on interface-dominated heat conduction and fluid transport physics, and highlights needs and opportunities for more research. One example is thermal switches for heat routing and transient temperature control. Recently we demonstrated 9:1 reversible thermal resistance ratios using Li intercalation in MoS2 multilayers. Another example is template-fabricated copper inverse opals which, when conformally coated into laser-etched diamond microchannels, facilitate very large heat fluxes for microfluidic two-phase heat sinks. These inverse opals can also encapsulate phase change materials, promising high effective heat capacity and thermal conductivity. This talk will highlight collaborations with the semiconductor industry, US defense companies and the NSF center on power electronics (POETS).

Bio Sketch: Ken Goodson chairs the Mechanical Engineering Department and holds the Davies Family Provostial Professorship at Stanford University. He is a heat transfer researcher, specializing in electronics cooling at multiple scales from nano conduction to microfluidic heat sinks. His lab has graduated 40 PhDs, nearly half of whom are professors at schools including MIT, Stanford, and UC Berkeley. Honors include the Kraus Medal, the Heat Transfer Memorial Award, the AIChE Kern Award, and Fellow grade with ASME, IEEE, APS, and AAAS. Goodson received the PhD (1993) from MIT and in 2001 he co-founded Cooligy, which built microfluidic cooling systems for the Apple G5 and was acquired by Emerson in 2006. At Stanford, serving as Mechanical Engineering Chair and Vice Chair since 2008, Goodson has led two strategic plans and launched hiring actions for 15 new faculty who are transforming the department's scholarship and diversity. 12:30PM – 2:00PM